Search

Now showing items 1-5 of 5

Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

Type: Journal Paper

Author : Marinissen, Erik Jan

Publisher: IEEE

Year: 2014

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Type: Journal Paper

Author : Chun-Chuan Chi; Marinissen, Erik Jan; Goel, Sandeep Kumar; Cheng-Wen Wu

Publisher: IEEE

Year: 2014

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Type: Conference Paper

Author : Marinissen, Erik Jan; De Wachter, Bart; Smith, Ken; Kiesewetter, Jorg; Taouil, Mottaqiallah; Hamdioui, Said

Publisher: IEEE

Year: 2014

Cost components for 3D system integration

Type: Conference Paper

Author : Velenis, Dimitrios; Detalle, Mikael; Van Huylenbroeck, Stefaan; Jourdain, Anne; Phommahaxay, Alain; Slabbekoorn, John; Wang, Teng; Marinissen, Erik Jan; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

Reflow process optimization for micro-bumps applications in 3D technology

Type: Conference Paper

Author : Derakhshandeh, Jaber; De Preter, Inge; England, Luke; Schmid, Daniel; Slabbekoorn, John; Vakanas, George; Wang, Teng; Beyer, Gerald; Beyne, Eric; Marinissen, Erik Jan; Rebibis, Kenneth June; Lerch, Wilfried; Miller, Andy

Publisher: IEEE

Year: 2014

Search

Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Cost components for 3D system integration

Reflow process optimization for micro-bumps applications in 3D technology

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

Mr. Synopsys Speaks: The <italic>Aart</italic> of Tech-Onomic Orchestration of Adjacent Version <inline-formula> <img src="/images/tex/21222.gif" alt="n+1"> </inline-formula>

Low-Cost Post-Bond Testing of 3-D ICs Containing a Passive Silicon Interposer Base

Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface

Cost components for 3D system integration

Reflow process optimization for micro-bumps applications in 3D technology