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Grafting and properties of a porous poly(methyl methacrylate) film on a silicon surface by a one-step dipping method

Type: Journal Paper

Author : Shanshan Zhang; Junhong Zhang; Ming Li; Wenqi Zhang; Liqiang Cao

Year: 2017

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Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints

Type: Conference Paper

Author : Hongwen He; Liqiang Cao; Hu Hao; Limin Ma; Fu Guo

Publisher: IEEE

Year: 2014

Electrical characterization and analysis on the via-solder ball structure

Type: Conference Paper

Author : Yi He; Jun Li; Fengman Liu; Peng Wu; Liqiang Cao

Publisher: IEEE

Year: 2014

Multilayer chip embedded based on the organic substrate

Type: Conference Paper

Author : Xueping Guo; Zhongyao Yu; Liqiang Cao; Yang Song; Yu Sun; Zhidan Fang; Hu Hao; Guowei Ding

Publisher: IEEE

Year: 2014

Analysis on electromagnetic isolation issues among multi-chips in system in package

Type: Conference Paper

Author : Peng Wu; Fengman Liu; Yi He; Huimin He; Jun Li; Liqiang Cao; Dongkai Shangguan; Lixi Wan

Publisher: IEEE

Year: 2014

A study of high-density embedded capacitor for silicon-substrate package

Type: Journal Paper

Author : Huijuan Wang; Fengwei Dai; Daniel Guidotti; Yao Lv; Liqiang Cao; Lixi Wan

Year: 2010

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Grafting and properties of a porous poly(methyl methacrylate) film on a silicon surface by a one-step dipping method

Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints

Electrical characterization and analysis on the via-solder ball structure

Multilayer chip embedded based on the organic substrate

Analysis on electromagnetic isolation issues among multi-chips in system in package

A study of high-density embedded capacitor for silicon-substrate package

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Grafting and properties of a porous poly(methyl methacrylate) film on a silicon surface by a one-step dipping method

Whisker growth in the crack region of the cathode interface during current stressing process in lead-free solder joints

Electrical characterization and analysis on the via-solder ball structure

Multilayer chip embedded based on the organic substrate

Analysis on electromagnetic isolation issues among multi-chips in system in package

A study of high-density embedded capacitor for silicon-substrate package