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A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission

Type: Journal Paper

Author : Eakhwan Song; Jeonghyeon Cho; Woojin Lee; Minchul Shin; Joungho Kim

Year: 2008

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Power distribution networks for system-on-package: status and challenges

Type: Journal Paper

Author : Swaminathan, M.; Joungho Kim; Novak, I.; Libous, J.P.

Year: 2004

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3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB

Type: Journal Paper

Author : Tae Hong Kim; Junho Lee; Hyungsoo Kim; Joungho Kim

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Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

Type: Journal Paper

Author : Jongjoo Shim; Dong Gun Kam; Jong Hwa Kwon; Joungho Kim

Year: 2010

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[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Type: Journal Paper

Author : Kyoungchoul Koo,; Jiseong Kim,; Myunghoi Kim,; Joungho Kim,

Year: 2010

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Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Type: Journal Paper

Author : Eakhwan Song; Jeonghyeon Cho; Jiseong Kim; Yujeong Shim; Gawon Kim; Joungho Kim

Year: 2010

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Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

Type: Journal Paper

Author : Jingook Kim; Ketan Shringarpure; Jun Fan; Joungho Kim; James L. Drewniak

Year: 2011

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A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Type: Journal Paper

Author : Myunghoi Kim; Kyoungchoul Koo; Chulsoon Hwang; Yujeong Shim; Joungho Kim; Jonghoon Kim

Year: 2012

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Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Type: Journal Paper

Author : Myunghoi Kim; Kyoungchoul Koo; Yujeong Shim; Chulsoon Hwang; Jun So Pak; Seungyoung Ahn; Joungho Kim

Year: 2013

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Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

Type: Journal Paper

Author : Jinwoo Choi; Dong Gun Kam; Daehyun Chung; Krishna Srinivasan; Vinu Govind; Joungho Kim; Madhavan Swaminathan

Year: 2007

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A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission

Power distribution networks for system-on-package: status and challenges

3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB

Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications

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A Wide-Band Passive Equalizer Design on PCB Based on Near-End Crosstalk and Reflections for 12.5 Gbps Serial Data Transmission

Power distribution networks for system-on-package: status and challenges

3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB

Circuital Modeling and Measurement of Shielding Effectiveness Against Oblique Incident Plane Wave on Apertures in Multiple Sides of Rectangular Enclosure

[IEEE 2010 IEEE International Symposium on Electromagnetic Compatibility - EMC 2010 - Fort Lauderdale, FL (2010.07.25-2010.07.30)] 2010 IEEE International Symposium on Electromagnetic Compatibility - Impact of PCB design on switching noise and EMI of synchronous DC-DC buck converter

Modeling and Design Optimization of a Wideband Passive Equalizer on PCB Based on Near-End Crosstalk and Reflections for High-Speed Serial Data Transmission

Equivalent Circuit Model for Power Bus Design in Multi-Layer PCBs With Via Arrays

A Compact and Wideband Electromagnetic Bandgap Structure Using a Defected Ground Structure for Power/Ground Noise Suppression in Multilayer Packages and PCBs

Vertical Stepped Impedance EBG (VSI-EBG) Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs

Near-Field and Far-Field Analyses of Alternating Impedance Electromagnetic Bandgap (AI-EBG) Structure for Mixed-Signal Applications