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Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs

Type: Conference Paper

Author : Filipovic, L. , de Orio, R.L. , Selberherr, S.

Publisher: IEEE

Year: 2014

Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs

Type: Conference Paper

Author : Filipovic, L. , de Orio, R.L. , Selberherr, S.

Publisher: IEEE

Year: 2014

Author

Filipovic, L. , de Orio, R.L. , Selberherr, S. (2)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

32QAM WDM transmission (1)

Automotive engineering (1)

bit rate 255 Tbit/s (1)

bit rate 5.1 Tbit/s (1)

Capacitors (1)

Crosstalk (1)

distance 1 km (1)

hole-assisted few-mode multicore fiber (1)

Inductors (1)

MIMO (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

hermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (1)

hysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o (1)

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