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Now showing items 1-7 of 7

A differential evolution algorithm based source reconstruction technique

Type: Conference Paper

Author : Wei-Jiang Zhao; Binfang Wang; En-Xiao Liu

Publisher: IEEE

Year: 2014

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Type: Journal Paper

Author : Huapeng Zhao; En-Xiao Liu; Jun Hu; Er-Ping Li

Publisher: IEEE

Year: 2014

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Type: Journal Paper

Author : Zaw Oo Zaw; Xing Chang Wei; En-Xiao Liu; Er-Ping Li; Le-Wei Li

Year: 2008

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Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Type: Journal Paper

Author : Etienne Sicard; Wu Jianfei; R. J. Shen; Er-Ping Li; En-Xiao Liu; J. Kim; Jonghyun Cho; Madhavan Swaminathan

Year: 2015

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Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Type: Journal Paper

Author : Yao-Jiang Zhang; Zaw Zaw Oo; Xing-Chang Wei; En-Xiao Liu; Jun Fan; Er-Ping Li

Year: 2010

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Recent advances in electromagnetic compatibility of 3D-ICs — Part II

Type: Journal Paper

Author : Etienne Sicard; Wu Jianfei; Rongjun Shen; Er-Ping Li; En-Xiao Liu; Joungho Kim; Jonghyun Cho; Madhavan Swaminathan

Year: 2016

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3D traffic noise mapping using unstructured surface mesh representation of buildings and roads

Type: Journal Paper

Author : Wei-Jiang Zhao; En-Xiao Liu; Hee Joo Poh; Binfang Wang; Si-Ping Gao; Ching Eng Png; Kelvin Wenhui Li; Shyh Hao Chong

Year: 2017

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A differential evolution algorithm based source reconstruction technique

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Recent advances in electromagnetic compatibility of 3D-ICs — Part II

3D traffic noise mapping using unstructured surface mesh representation of buildings and roads

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A differential evolution algorithm based source reconstruction technique

Fast Contour Integral Equation Method for Wideband Power Integrity Analysis

Efficient analysis for multilayer power-ground planes with multiple vias and signal traces in an advanced electronic package

Recent advances in electromagnetic compatibility of 3D-ICs &2013; Part I

Systematic Microwave Network Analysis for Multilayer Printed Circuit Boards With Vias and Decoupling Capacitors

Recent advances in electromagnetic compatibility of 3D-ICs — Part II

3D traffic noise mapping using unstructured surface mesh representation of buildings and roads