In this paper, a new concept is developed for cooling integrated circuits (IC) in the electronic and

computer industries. Microliter liquid drops are employed in combination with the electrowetting

phenomenon ...

In this paper, a numerical study is performed to investigate the effects of thermal shrinkage on the deposition of molten particles on a substrate in a

thermal spray process using the Volume-of-Fluid (VOF) method. ...

A numerical method is proposed in this paper which is

capable of modeling the impact and deposition of semimolten

particles. By attributing a high viscosity to the solid

region, simulating the motion ...

In this paper, a new method of cooling hot-spots in electronic

devices is proposed based on the electrowetting phenomenon.

Since the microprocessor technology is developing with a fast

rate, conventional ...

In this paper, we performed a numerical study on the

effects of thermal shrinkage on the deposition of

molten tin droplets on a steel substrate in thermal spray

coating process using Volume-of-Fluid ...

In this paper, experiments and numerical simulations are performed to study the effects of electric field on the contact angle of a sessile liquid drop resting on a substrate in electrowetting-on-dielectric (EWOD) application. ...

A numerical method is proposed in this article which is capable of modeling the impact and deposition of

semi-molten particles. By attributing a high viscosity to the solid region, simulating the motion of ...