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    Design of Magneto-Inductive Magnetic Resonance Imaging Catheters 

    Type: Journal Paper
    Author : Segkhoonthod, Khoonsake; Syms, Richard R. /A/.; Young, Ian R.
    Publisher: IEEE
    Year: 2014

    Committees 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A Hybrid a-Si and Poly-Si TFTs Technology for AMOLED Pixel Circuits 

    Type: Journal Paper
    Author : Longyan Wang; Lei Sun; Dedong Han; Yi Wang; Mansun Chan; Shengdong Zhang
    Publisher: IEEE
    Year: 2014

    Shift of the optimized quality factor frequency for inductive wireless power applications 

    Type: Conference Paper
    Author : Thoen, B.; Stevens, N.
    Publisher: IEEE
    Year: 2014

    A 2D-3D Switchable Driving Method for Reducing Power Consumption of Thin-Film Transistor Liquid Crystal Display TV With Film-Type Patterned Retarder 

    Type: Journal Paper
    Author : Do-Sung Kim; Hee-Young Chae; Sung-Hak Jo; Oh-Kyong Kwon
    Publisher: IEEE
    Year: 2014

    Internal wave simulation for different angles and shapes of continental shelf 

    Type: Conference Paper
    Author : Pradhan, Himansu K.; Rao, A.D.; Reddy, K.K.G.; Mohanty, S.
    Publisher: IEEE
    Year: 2014

    A Complete Fully Thin-Film PV Harvesting and Power-Management System on Plastic With On-Sheet Battery Management and Wireless Power Delivery to Off-sheet Loads 

    Type: Journal Paper
    Author : Rieutort-Louis, Warren; Liechao Huang; Yingzhe Hu; Sanz-Robinson, Josue; Wagner, Steffen; Sturm, James C.; Verma, Naveen
    Publisher: IEEE
    Year: 2014

    [Copyright notice] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Designing LU-QR Hybrid Solvers for Performance and Stability 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    A sensitivity study of land surface temperature to soil moisture using in-situ and spaceborne observations 

    Type: Conference Paper
    Author : Pablos, M.; Piles, M.; Sanchez, N.; Gonzalez-Gambau, V.; Vall-llossera, M.; Camps, A.; Martinez-Fernandez, J.
    Publisher: IEEE
    Year: 2014
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