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    Magnetic Property Enhancement of FePt Films by Zr Underlayering 

    Type: Journal Paper
    Author : Shen, C.Y.; Chang, H.W.; Yuan, F.T.; Lin, M.C.; Su, C.C.; Wang, C.R.; Mei, J.K.; Chen, Choon Chowe; Chang, Wen Cheng
    Publisher: IEEE
    Year: 2014

    Considerations regarding shielding effectiveness and testing of electromagnetic protected enclosures used in communications security 

    Type: Conference Paper
    Author : Bindar, V. , Popescu, M. , Vulpe, A.
    Publisher: IEEE
    Year: 2014

    Evidences for field emission initiated glow discharge at high currents 

    Type: Conference Paper
    Author : Wenger, D. , Knapp, W. , Hensel, B. , Tedde, S.F.
    Publisher: IEEE
    Year: 2014

    Cu-Containing [Pt/Co] Multilayers With Low Saturation Magnetization Suitable for the Pinned Structure 

    Type: Journal Paper
    Author : Dong Su Son; Tae Young Lee; Sang Ho Lim; Seong-Rae Lee
    Publisher: IEEE
    Year: 2014

    Barrier Properties of CVD Mn Oxide Layer to Cu Diffusion for 3-D TSV 

    Type: Journal Paper
    Author : Kang-Wook Lee; Hao Wang; Ji-Cheol Bea; Murugesan, Mariappan; Sutou, Y.; Fukushima, Tetsuya; Tanaka, T.; Koike, Junichi; Koyanagi, Mitsumasa
    Publisher: IEEE
    Year: 2014

    Categorization of copies to improve the performance of routing schemes in delay tolerant networks 

    Type: Conference Paper
    Author : Naha, Tanmoy; Barua, Shaikat; Iqbal, Shahid Md.Asif; Chowdhury, Alok Kumar; Dhar, Kingshuk
    Publisher: IEEE
    Year: 2014

    Analysis & implementation of item based collaboration filtering using K-Medoid 

    Type: Conference Paper
    Author : Mishra, D.; Hiranwal, S.
    Publisher: IEEE
    Year: 2014

    Bit based symmetric encryption method using DNA Sequence 

    Type: Conference Paper
    Author : Jain, S.; Bhatnagar, V.
    Publisher: IEEE
    Year: 2014

    High-temperature acoustic emission sensing tests using a Yttrium calcium oxyborate sensor 

    Type: Journal Paper
    Author : Johnson, Jamie; Kyungrim Kim; Shujun Zhang; Di Wu; Xiaoning Jiang
    Publisher: IEEE
    Year: 2014

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