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    Mapping smooth profile H-plane rectangular waveguide structures to substrate integrated waveguide technology 

    Type: Journal Paper
    Author : Diaz Caballero, Elena; Roldan, I.; Urrea, V.; Chudzik, M.; Arregui, I.; Arnedo, I.; Belenguer, Angel
    Publisher: IET
    Year: 2014

    A Linear Phase Filter in Quadruplet Topology With Frequency-Dependent Couplings 

    Type: Journal Paper
    Author : Szydlowski, Lukasz; Leszczynska, Natalia; Mrozowski, Micha
    Publisher: IEEE
    Year: 2014

    3 dB 90<formula formulatype="inline"> <img src="/images/tex/540.gif" alt="^{\\circ}"> </formula> Hybrid Quasi-Optical Coupler With Air Field Slab in SIW Technology 

    Type: Journal Paper
    Author : Djerafi, Tarek; Wu, Kaijie; Tatu, Serioja Ovidiu
    Publisher: IEEE
    Year: 2014

    Characterization of improved Capacitive Micromachined Ultrasonic Transducers (CMUTS) using ALD high-&#x039A; dielectric isolation 

    Type: Conference Paper
    Author : Xu, T. , Tekes, C. , Degertekin, F.L.
    Publisher: IEEE
    Year: 2014

    An Asynchronous Distributed Algorithm for Constructing a Connected Dominating Set Optimized by Minimum-Weight Spanning Tree 

    Type: Conference Paper
    Author : Ren, Sijun; Yi, Ping; Wu, Yue; Li, Jianhua
    Publisher: IEEE
    Year: 2014

    Photon Pulses based Heterodyne Detection Precision Ranging System 

    Type: Conference Paper
    Author : Lei, Li-Xia; Zhang, Yue-Jin
    Publisher: IEEE
    Year: 2014

    Ultrapiano: A novel human-machine interface applied to virtual reality 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Millimeter-Wave Continuous Transverse Stub (CTS) Antenna Array Using Substrate Integrated Waveguide (SIW) Technology 

    Type: Journal Paper
    Author : Hyeonhyeong Choe; Sungjoon Lim
    Publisher: IEEE
    Year: 2014

    300-GHz Step-Profiled Corrugated Horn Antennas Integrated in LTCC 

    Type: Journal Paper
    Author : Tajima, Tsutomu; Ho-Jin Song; Ajito, K.; Yaita, Makoto; Kukutsu, Naoya
    Publisher: IEEE
    Year: 2014

    A Wire Bonding Structure Directly Based on Substrate Integrated Waveguide Technology 

    Type: Journal Paper
    Author : Hui Zhang; Wei Hong
    Publisher: IEEE
    Year: 2014
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