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Methods for planar integrated low pass filter performance improvements in high frequency

Type: Conference Paper

Author : Racasan, Adina; Munteanu, Calin; Topa, Vasile; Pacurar, Claudia; Hebedean, Claudia; Cislariu, Mihaela

Publisher: IEEE

Year: 2014

Analytical Theory for Extracting Specific Contact Resistances of Thick Samples From the Transmission Line Method

Type: Journal Paper

Author : Eidelloth, Stefan; Brendel, Rolf

Publisher: IEEE

Year: 2014

Enabling Efficient Power Provisioning for Enterprise Applications

Type: Conference Paper

Author : Subramaniam, B. , Wu-Chun Feng

Publisher: IEEE

Year: 2014

Design of Low Power UWB CMOS LNA Based on Common Source Inductor

Type: Conference Paper

Author : Hsu, Meng Ting , Hsieh, Yu Chang , Huang, Wei Lun

Publisher: IEEE

Year: 2014

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

Type: Journal Paper

Author : Yu-San Chien; Yan-Pin Huang; Ruoh-Ning Tzeng; Ming-Shaw Shy; Teu-Hua Lin; Kou-Hua Chen; Chi-Tsung Chiu; Ching-Te Chuang; Wei Hwang; Jin-Chern Chiou; Ho-Ming Tong; Kuan-Neng Chen

Publisher: IEEE

Year: 2014

High Performance 400 °C p<sup>+</sup>/n Ge Junctions Using Cryogenic Boron Implantation

Type: Journal Paper

Author : Bhatt, Piyush; Swarnkar, Prashant; Basheer, Firdous; Hatem, Christopher; Nainani, Aneesh; Lodha, Saurabh

Publisher: IEEE

Year: 2014

The study of high frequency electromagnetic shielding performance by numerical modeling

Type: Conference Paper

Author : Miron, Florin; Purcar, Marius; Munteanu, Calin; Mihai, George

Publisher: IEEE

Year: 2014

Humanitarian technology research group: Developments at the University of Adelaide

Type: Conference Paper

Author : Birzer, C.H.; Medwell, P.R.; Kalt, P.A.M

Publisher: IEEE

Year: 2014

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Type: Conference Paper

Publisher: IEEE

Year: 2014

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Methods for planar integrated low pass filter performance improvements in high frequency

Analytical Theory for Extracting Specific Contact Resistances of Thick Samples From the Transmission Line Method

Enabling Efficient Power Provisioning for Enterprise Applications

Design of Low Power UWB CMOS LNA Based on Common Source Inductor

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

High Performance 400 °C p<sup>+</sup>/n Ge Junctions Using Cryogenic Boron Implantation

The study of high frequency electromagnetic shielding performance by numerical modeling

Humanitarian technology research group: Developments at the University of Adelaide

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

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Methods for planar integrated low pass filter performance improvements in high frequency

Analytical Theory for Extracting Specific Contact Resistances of Thick Samples From the Transmission Line Method

Enabling Efficient Power Provisioning for Enterprise Applications

Design of Low Power UWB CMOS LNA Based on Common Source Inductor

Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration

High Performance 400 &#x00B0;C p<sup>+</sup>/n Ge Junctions Using Cryogenic Boron Implantation

The study of high frequency electromagnetic shielding performance by numerical modeling

Humanitarian technology research group: Developments at the University of Adelaide

Modeling CPU Energy Consumption of HPC Applications on the IBM POWER7

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High Performance 400 °C p<sup>+</sup>/n Ge Junctions Using Cryogenic Boron Implantation