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For a better understanding of Live Working

Type: Conference Paper

Author : Portillo, M.

Publisher: IEEE

Year: 2014

A regulatory framework for implementation of machine to machine services

Type: Conference Paper

Publisher: IEEE

Year: 2014

Design and stress analysis for fine pitch flip chip packages with copper column interconnects

Type: Conference Paper

Author : Ming-Che Hsieh; Su-Lan Tzeng

Publisher: IEEE

Year: 2014

Author

Ming-Che Hsieh (1)

Portillo, M. (1)

Su-Lan Tzeng (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

Doppler radar (2)

Radar antennas (2)

AAA batteries (1)

AC-coupled continuous-wave (1)

Accuracy (1)

Antenna radiation patterns (1)

application specific time (1)

Bandwidth (1)

Beam steering (1)

body movements (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

ireless and Mobile, 2014 IEEE Asia Pacific Conference on (1)

ive Maintenance (ICOLIM), 2014 11th International Conference on (1)

lectronic Packaging Technology (ICEPT), 2014 15th International Conference on (1)

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