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Characterization of the Proximity Effect From Tungsten TSVs on 130-nm CMOS Devices in 3-D ICs

Type: Journal Paper

Author : Sangwook Han; Wentzloff, David D.

Publisher: IEEE

Year: 2014

Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification

Type: Journal Paper

Author : Minki Cho; Ahmed, Khondker Zakir; Song, William J.; Yalamanchili, Sudhakar; Mukhopadhyay, Saibal

Publisher: IEEE

Year: 2014

Polar Quantizer for Wireless Receivers: Theory, Analysis, and CMOS Implementation

Type: Journal Paper

Author : Nazari, Peyman; Byung-Kwan Chun; Tzeng, Fred; Heydari, Payam

Publisher: IEEE

Year: 2014

A 60-dB Gain OTA Operating at 0.25-V Power Supply in 130-nm Digital CMOS Process

Type: Journal Paper

Author : Ferreira, Luis H. C.; Sonkusale, Sameer R.

Publisher: IEEE

Year: 2014

Resilient Pipeline Under Supply Noise With Programmable Time Borrowing and Delayed Clock Gating

Type: Journal Paper

Author : Kwanyeob Chae; Mukhopadhyay, Saibal

Publisher: IEEE

Year: 2014

DSP aided chromatic dispersion reckoning in single carrier high speed coherent optical communications

Type: Conference Paper

Publisher: IEEE

Year: 2014

The energy benefit of level-crossing sampling including the actuator's energy consumption

Type: Conference Paper

Author : Hensel, B. , Kabitzsch, K.

Publisher: IEEE

Year: 2014

Complementary resistive switch based stateful logic operations using material implication

Type: Conference Paper

Publisher: IEEE

Year: 2014

Symmetric Coherent Link Degree, Adaptive Throughput-Transmission Power for Wireless Sensor Networks

Type: Conference Paper

Publisher: IEEE

Year: 2014

Multilevel descriptive experiment design regularization framework for sparsity preserving enhancement of radar imagery in harsh sensing environments

Type: Conference Paper

Publisher: IEEE

Year: 2014

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Characterization of the Proximity Effect From Tungsten TSVs on 130-nm CMOS Devices in 3-D ICs

Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification

Polar Quantizer for Wireless Receivers: Theory, Analysis, and CMOS Implementation

A 60-dB Gain OTA Operating at 0.25-V Power Supply in 130-nm Digital CMOS Process

Resilient Pipeline Under Supply Noise With Programmable Time Borrowing and Delayed Clock Gating

DSP aided chromatic dispersion reckoning in single carrier high speed coherent optical communications

The energy benefit of level-crossing sampling including the actuator's energy consumption

Complementary resistive switch based stateful logic operations using material implication

Symmetric Coherent Link Degree, Adaptive Throughput-Transmission Power for Wireless Sensor Networks

Multilevel descriptive experiment design regularization framework for sparsity preserving enhancement of radar imagery in harsh sensing environments

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Characterization of the Proximity Effect From Tungsten TSVs on 130-nm CMOS Devices in 3-D ICs

Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification

Polar Quantizer for Wireless Receivers: Theory, Analysis, and CMOS Implementation

A 60-dB Gain OTA Operating at 0.25-V Power Supply in 130-nm Digital CMOS Process

Resilient Pipeline Under Supply Noise With Programmable Time Borrowing and Delayed Clock Gating

DSP aided chromatic dispersion reckoning in single carrier high speed coherent optical communications

The energy benefit of level-crossing sampling including the actuator's energy consumption

Complementary resistive switch based stateful logic operations using material implication

Symmetric Coherent Link Degree, Adaptive Throughput-Transmission Power for Wireless Sensor Networks

Multilevel descriptive experiment design regularization framework for sparsity preserving enhancement of radar imagery in harsh sensing environments