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A prediction model for the quantitative description of wire fray fault

Type: Conference Paper

Author : Chen Yalun; Wang Li

Publisher: IEEE

Year: 2014

Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICs

Type: Journal Paper

Author : Li-Ren Huang; Shi-Yu Huang; Kun-Han Tsai; Wu-Tung Cheng

Publisher: IEEE

Year: 2014

Author

Chen Yalun (1)

Kun-Han Tsai (1)

Li-Ren Huang (1)

Shi-Yu Huang (1)

Wang Li (1)

Wu-Tung Cheng (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

Circuit faults (2)

Delays (2)

resistive bridging faults (2)

2.5D ICs (1)

2.5D stacked integrated circuit (1)

asynchronous circuits (1)

Bridge circuits (1)

catastrophic faults (1)

elemental semiconductors (1)

fault diagnosis (1)

Type

Conference Paper (1)

Journal Paper (1)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on (1)

ransportation Electrification Asia-Pacific (ITEC Asia-Pacific), 2014 IEEE Conference and Expo (1)

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