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Now showing items 1-7 of 7
A high density Twin-Gate OTP cell in pure 28nm CMOS process
Publisher: IEEE
Year: 2014
From compact model to innovative circuit design of Ag-GeS<sup>2</sup> conductive bridge memories
Publisher: IEEE
Year: 2014
Metamaterial-enhanced arrays by innovative QCTO approaches
Publisher: IEEE
Year: 2014
Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography
Publisher: IEEE
Year: 2014
Sequential stress combinations in product level reliability testing of industrial electronics
Publisher: IEEE
Year: 2014
Thermal and mechanical reliability of low-temperature solder alloys for handheld devices
Publisher: IEEE
Year: 2014