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A high density Twin-Gate OTP cell in pure 28nm CMOS process

Type: Conference Paper

Publisher: IEEE

Year: 2014

From compact model to innovative circuit design of Ag-GeS<sup>2</sup> conductive bridge memories

Type: Conference Paper

Publisher: IEEE

Year: 2014

Metamaterial-enhanced arrays by innovative QCTO approaches

Type: Conference Paper

Publisher: IEEE

Year: 2014

Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography

Type: Conference Paper

Publisher: IEEE

Year: 2014

Sequential stress combinations in product level reliability testing of industrial electronics

Type: Conference Paper

Author : Pippola, J.; Marttila, T.; Frisk, L.

Publisher: IEEE

Year: 2014

Comparative analysis of multi-agent systems and Kanban system in the construction of operational production plans for engineering enterprises

Type: Conference Paper

Author : Medvedev, S.N.; Aksyonov, K.A.

Publisher: IEEE

Year: 2014

Thermal and mechanical reliability of low-temperature solder alloys for handheld devices

Type: Conference Paper

Author : Ribas, Morgana; Chegudi, Sujatha; Kumar, Anil; Pandher, Ranjit; Raut, Rahul; Mukherjee, Sutapa; Sarkar, Siuli; Singh, Bawa

Publisher: IEEE

Year: 2014

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A high density Twin-Gate OTP cell in pure 28nm CMOS process

From compact model to innovative circuit design of Ag-GeS<sup>2</sup> conductive bridge memories

Metamaterial-enhanced arrays by innovative QCTO approaches

Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography

Sequential stress combinations in product level reliability testing of industrial electronics

Comparative analysis of multi-agent systems and Kanban system in the construction of operational production plans for engineering enterprises

Thermal and mechanical reliability of low-temperature solder alloys for handheld devices

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A high density Twin-Gate OTP cell in pure 28nm CMOS process

From compact model to innovative circuit design of Ag-GeS<sup>2</sup> conductive bridge memories

Metamaterial-enhanced arrays by innovative QCTO approaches

Design of a force-decoupled compound parallel alignment stage for high-resolution imprint lithography

Sequential stress combinations in product level reliability testing of industrial electronics

Comparative analysis of multi-agent systems and Kanban system in the construction of operational production plans for engineering enterprises

Thermal and mechanical reliability of low-temperature solder alloys for handheld devices