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Now showing items 1-10 of 19
Investigation on AlCu-clad base plates and a new by-pass cooler for pin fin power modules
Publisher: IEEE
Year: 2014
Laminate with Thermal - Power Insert for Efficient Front-Side Heat Removal and Power Delivery
Publisher: IEEE
Year: 2014
Surface Profiles of Printed Ag Nanoparticle Paste and Their Implication on the Quality of Sintered Joints
Publisher: IEEE
Year: 2014
Reliability assessment of molded Smart Power Modules
Publisher: IEEE
Year: 2014
3D stereoscopic game development technique for smart TVs
Publisher: IEEE
Year: 2014
Haptic strip based on modular independent actuators for virtual shapes rendering
Publisher: IEEE
Year: 2014
100K Q-factor toroidal ring gyroscope implemented in wafer-level epitaxial silicon encapsulation process
Publisher: IEEE
Year: 2014
AlGaN/GaN MIS-HFET with improvement in high temperature gate bias stress-induced reliability
Publisher: IEEE
Year: 2014
Misleading Generalized Itemset Mining in the Cloud
Publisher: IEEE
Year: 2014