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Now showing items 1-10 of 20

The development of a data-driven application benchmarking approach to performance modelling

Type: Conference Paper

Publisher: IEEE

Year: 2014

CONCERT: a cloud-based architecture for next-generation cellular systems

Type: Journal Paper

Author : Jingchu Liu; Tao Zhao; Sheng Zhou; Yu Cheng; Zhisheng Niu

Publisher: IEEE

Year: 2014

Transmission Scheduling and Game Theoretical Power Allocation for Interference Coordination in CoMP

Type: Journal Paper

Author : Shu Fu; Bin Wu; Hong Wen; Pin-Han Ho; Gang Feng

Publisher: IEEE

Year: 2014

SwimmingLane: A composite approach to mitigate voltage droop effects in 3D power delivery network

Type: Conference Paper

Author : Xing Hu , Yi Xu , Yu Hu , Yuan Xie

Publisher: IEEE

Year: 2014

A bit-interleaved embedded hamming scheme to correct single-bit and multi-bit upsets for SRAM-based FPGAs

Type: Conference Paper

Author : Venkataraman, S.; Santos, R.; Das, A.; Kumar, A.

Publisher: IEEE

Year: 2014

Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

Type: Conference Paper

Publisher: IEEE

Year: 2014

Dual Uncertainty Minimization Regularization and Its Applications on Heterogeneous Data

Type: Conference Paper

Author : Cheng, Yu; Choudhary, Alok; Wang, Jun; Pankanti, Sharath; Liu, Huan

Publisher: IEEE

Year: 2014

A 2×2 lens-integrated on-chip antenna system for a 820 GHz multiplier-chain source in SiGe technology

Type: Conference Paper

Author : Grzyb, J. , Statnikov, K. , Pfeiffer, U.R.

Publisher: IEEE

Year: 2014

Cognitive routing and wavelength assignment algorithm for dynamic optical networks

Type: Conference Paper

Author : Zonglong Chen; Shuang Wang; Hao Zhang; Yumin Liu; Yunfeng Peng

Publisher: IEEE

Year: 2014

Mobile Clouds as the Building Blocks of Shareconomy: Sharing Resources Locally and Widely

Type: Journal Paper

Author : Katz, Marcos; Fitzek, Frank H. P.; Lucani, Daniel E.; Seeling, Patrick

Publisher: IEEE

Year: 2014

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The development of a data-driven application benchmarking approach to performance modelling

CONCERT: a cloud-based architecture for next-generation cellular systems

Transmission Scheduling and Game Theoretical Power Allocation for Interference Coordination in CoMP

SwimmingLane: A composite approach to mitigate voltage droop effects in 3D power delivery network

A bit-interleaved embedded hamming scheme to correct single-bit and multi-bit upsets for SRAM-based FPGAs

Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

Dual Uncertainty Minimization Regularization and Its Applications on Heterogeneous Data

A 2×2 lens-integrated on-chip antenna system for a 820 GHz multiplier-chain source in SiGe technology

Cognitive routing and wavelength assignment algorithm for dynamic optical networks

Mobile Clouds as the Building Blocks of Shareconomy: Sharing Resources Locally and Widely

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The development of a data-driven application benchmarking approach to performance modelling

CONCERT: a cloud-based architecture for next-generation cellular systems

Transmission Scheduling and Game Theoretical Power Allocation for Interference Coordination in CoMP

SwimmingLane: A composite approach to mitigate voltage droop effects in 3D power delivery network

A bit-interleaved embedded hamming scheme to correct single-bit and multi-bit upsets for SRAM-based FPGAs

Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60&#x0446;m-pitch solder micro bump interconnections

Dual Uncertainty Minimization Regularization and Its Applications on Heterogeneous Data

A 2&#x00D7;2 lens-integrated on-chip antenna system for a 820 GHz multiplier-chain source in SiGe technology

Cognitive routing and wavelength assignment algorithm for dynamic optical networks

Mobile Clouds as the Building Blocks of Shareconomy: Sharing Resources Locally and Widely

Effect of joint shape controlled by thermocompression bonding on the reliability performance of 60цm-pitch solder micro bump interconnections

A 2×2 lens-integrated on-chip antenna system for a 820 GHz multiplier-chain source in SiGe technology