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    Rapid thermal processing of Cu<inf>2</inf>ZnSnSe<inf>4</inf> thin films 

    Type: Conference Paper
    Author : Fairbrother, A.; Fourdrinier, L.; Fontane, X.; Izquierdo-Roca, V.; Dimitrievska, M.; Perez-Rodriguez, A.; Saucedo, E.
    Publisher: IEEE
    Year: 2014

    Hybrid genetic algorithm &#x2014; Artificial neural network classifier for skin cancer detection 

    Type: Conference Paper
    Author : Aswin, R.B; Jaleel, J.Abdul; Salim, Sibi
    Publisher: IEEE
    Year: 2014

    All-purpose adjuster for microwave microstrip devices 

    Type: Conference Paper
    Author : Podstrigaev, A.S.
    Publisher: IEEE
    Year: 2014

    Reduction treatment of iron-ore technological raw material with the use of the high-power microwave electromagnetic fields 

    Type: Conference Paper
    Author : Dzenzerskiy, V.A.; Sokolovskiy, I.I.; Plaksin, S.V.; Bistrov, N.I.; Lavrich, Yu.N.; Pogorelaya, L.M.
    Publisher: IEEE
    Year: 2014

    Informal HCI: Fixing Playability Issues As A Strategy To Improve The Skills Of Novice Programmers 

    Type: Journal Paper
    Author : Barcelos, Thiago S.; Costa, Geiza C.; Munoz, Raul; Silveira, Ismar
    Publisher: IEEE
    Year: 2014

    Surface roughness measurement based on image texture analysis 

    Type: Conference Paper
    Author : Min, Li; Gao, Longfei; Zhang, Xiaoxia; Wang, Zhe
    Publisher: IEEE
    Year: 2014

    Three-dimensional motion estimation by straight-line and endpoint optical flow 

    Type: Conference Paper
    Author : Zhang, Congxuan; Chen, Zhen; Li, Ming; Wei, Shuigen
    Publisher: IEEE
    Year: 2014

    Remote sensing image registration using SIFT and vegetation index analysis 

    Type: Conference Paper
    Author : Lv, Buyun; Zhao, Liaoying; Li, Xiaorun
    Publisher: IEEE
    Year: 2014

    A Webber local binary pattern descriptor for pancreas endoscopic ultrasound image classification 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    H<inf>&#x221E;</inf> output regulation of linear systems 

    Type: Conference Paper
    Author : Ji Feifan , Xiang Ji
    Publisher: IEEE
    Year: 2014
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