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Wafer level warpage characterization for backside manufacturing processes of TSV interposers

Type: Conference Paper

Publisher: IEEE

Year: 2014

Image clusters based 3D virtual tour schema

Type: Conference Paper

Author : Dan Zhang; Rui Zheng; GuoSheng Yang

Publisher: IEEE

Year: 2014

Modeling and Analysis of a Flexible Capacitive Tactile Sensor Array for Normal Force Measurement

Type: Journal Paper

Author : Guanhao Liang; Deqing Mei; Yancheng Wang; Zichen Chen

Publisher: IEEE

Year: 2014

Author

Dan Zhang (1)

Deqing Mei (1)

Guanhao Liang (1)

GuoSheng Yang (1)

Rui Zheng (1)

Yancheng Wang (1)

Zichen Chen (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

force measurement (3)

normal force measurement (3)

flexible capacitive tactile sensor array (2)

Force (2)

polymer films (2)

shear force (2)

tactile sensors (2)

analytical (1)

Analytical models (1)

Arrays (1)

Type

Conference Paper (2)

Journal Paper (1)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (1)

oftware Engineering and Service Science (ICSESS), 2014 5th IEEE International Conference on (1)

Sensors Journal, IEEE (1)

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