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Chip package interaction induced ILD integrity issues in fine pitch flip chip packages

Type: Conference Paper

Publisher: IEEE

Year: 2014

Carbon nanotube/solder hybrid structure for interconnect applications

Type: Conference Paper

Author : Jiang, Di; Sun, Shuangxi; Mu, Wei; Fu, Yifeng; Liu, Johan

Publisher: IEEE

Year: 2014

Author

Fu, Yifeng (1)

Jiang, Di (1)

Liu, Johan (1)

Mu, Wei (1)

Sun, Shuangxi (1)

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IEEE (2)

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2014 (2)

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Accuracy (1)

Internet (1)

n ant colony optimization (1)

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Conference Paper (2)

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lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th (1)

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

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