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Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices

Type: Conference Paper

Author : Goldberg, Adrian; Ihle, Martin; Ziesche, Steffen; Kulls, Robert

Publisher: IEEE

Year: 2014

Investigation of effects of die thinning on central TSV bus driver thermal performance

Type: Conference Paper

Author : Melamed, Samson; Imura, Fumito; Aoyagi, Masahiro; Nakagawa, Hiroshi; Kikuchi, Katsuya; Hagimoto, Michiya; Matsumoto, Yukoh

Publisher: IEEE

Year: 2014

Observation of the permeation on the subcutaneous during the administration of drug and development of a needle

Type: Conference Paper

Author : Kawata, Kento; Tsuchiya, Kazuyoshi; Kajiwara, Kagemasa; Kimura, Minoru

Publisher: IEEE

Year: 2014

Author

Aoyagi, Masahiro (1)

Goldberg, Adrian (1)

Hagimoto, Michiya (1)

Ihle, Martin (1)

Imura, Fumito (1)

Kajiwara, Kagemasa (1)

Kawata, Kento (1)

Kikuchi, Katsuya (1)

Kimura, Minoru (1)

Kulls, Robert (1)

Publisher

IEEE (3)

Year

2014 (3)

Keywords

n turnaround time (2)

cache storage (1)

cloud computing (1)

Java (1)

n academic spheres (1)

n Acceleration (1)

n Accurac (1)

n architectural complexity (1)

n average waiting time (1)

n bar charts (1)

Type

Conference Paper (3)

Language (ISO)

English (3)

Content Type

Metadata Only (3)

Publication Title

hermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on (1)

icro-NanoMechatronics and Human Science (MHS), 2014 International Symposium on (1)

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

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