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Type: Conference Paper

Publisher: IEEE

Year: 2014

Investigating wire bonding pull testing and its calculation basics

Type: Conference Paper

Author : Schmitz, S.; Kripfgans, J.; Schneider-Ramelow, M.; Muller, Wolfgang H.; Lang, K.-D.

Publisher: IEEE

Year: 2014

Influence of curing conditions on mechanical properties and reliability of the interconnects made by ICA for printed electronics with micro additives

Type: Conference Paper

Author : Koscielski, Marek; Sitek, Janusz

Publisher: IEEE

Year: 2014

The formation of modern Chinese imperative sentence combining

Type: Conference Paper

Author : Zhao, Hao; Shi, Shuqin

Publisher: IEEE

Year: 2014

Plasma dynamics of microwave excited microplasmas in a sub-millimeter cavity

Type: Conference Paper

Author : Peng Tian; Kushner, M.J.; Denning, M.; Vahidpour, M.; Urdahl, R.

Publisher: IEEE

Year: 2014

A simulation strategy to optimize the design of internet enabled logistics services

Type: Conference Paper

Author : Lusanga, P.K.; Hoffman, A.J; de Coning, A.; Bhero, E.

Publisher: IEEE

Year: 2014

Modeling and simulation of hybrid power flow controller implemented on SMIB system

Type: Conference Paper

Author : Mathew, Lini; Chatterji, S.

Publisher: IEEE

Year: 2014

A range-based sleep scheduling algorithm for desired area coverage in solar-powered wireless sensor networks

Type: Conference Paper

Author : Li, Xueyan; Chen, Hongbin; Zhao, Feng; Li, Xiaohuan

Publisher: IEEE

Year: 2014

A low power 720p motion estimation processor with 3D stacked memory

Type: Conference Paper

Author : Zhang, Shuping; Zhou, Jinjia; Zhou, Dajiang; Goto, Satoshi

Publisher: IEEE

Year: 2014

Interference-Aware Interference Mitigation for Device-to-Device Communications

Type: Conference Paper

Author : Kwon, Hyukjoon; Lee, Jungwon; Kang, Inyup

Publisher: IEEE

Year: 2014

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Table of contents

Investigating wire bonding pull testing and its calculation basics

Influence of curing conditions on mechanical properties and reliability of the interconnects made by ICA for printed electronics with micro additives

The formation of modern Chinese imperative sentence combining

Plasma dynamics of microwave excited microplasmas in a sub-millimeter cavity

A simulation strategy to optimize the design of internet enabled logistics services

Modeling and simulation of hybrid power flow controller implemented on SMIB system

A range-based sleep scheduling algorithm for desired area coverage in solar-powered wireless sensor networks

A low power 720p motion estimation processor with 3D stacked memory

Interference-Aware Interference Mitigation for Device-to-Device Communications

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Table of contents

Investigating wire bonding pull testing and its calculation basics

Influence of curing conditions on mechanical properties and reliability of the interconnects made by ICA for printed electronics with micro additives

The formation of modern Chinese imperative sentence combining

Plasma dynamics of microwave excited microplasmas in a sub-millimeter cavity

A simulation strategy to optimize the design of internet enabled logistics services

Modeling and simulation of hybrid power flow controller implemented on SMIB system

A range-based sleep scheduling algorithm for desired area coverage in solar-powered wireless sensor networks

A low power 720p motion estimation processor with 3D stacked memory

Interference-Aware Interference Mitigation for Device-to-Device Communications