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Challenges and solutions on pre-assembly processes for thinned 3D wafers with micro-bumps on the backside
Publisher: IEEE
Year: 2014
Reliable data delivery for emergency and disaster recovery in wireless mesh network
Publisher: IEEE
Year: 2014
OFDM for short-reach optical networks
Publisher: IEEE
Year: 2014
Sliding mode fuzzy observers and neural networks applied to solve fault detection and isolation problem
Publisher: IEEE
Year: 2014
Adaptive device cloud for Internet of Things applications
Publisher: IEEE
Year: 2014