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Now showing items 1-10 of 17

Hardware-software complex of interferencing situation control and localization of electromagnetic radiation sources

Type: Conference Paper

Author : Bobrikhin, A.F.; Gudkov, A.G.; Leushin, V.Yu.; Meshkov, S.A.; Kolpakov, N.S.; Porokhov, I.O.; Silkin, A.T.

Publisher: IEEE

Year: 2014

SDF: A Sign Description Framework for Cross-Context Information Resource Representation and Interchange

Type: Conference Paper

Author : Jingzhi Guo

Publisher: IEEE

Year: 2014

Transformer high frequency modelling based on lumped parameter model by consideration of corelosses

Type: Conference Paper

Author : Zeinali, Reza; Ghanizadeh, Ahmad Javid; Asl, Rasul Tarvirdilu; Gharehpetian, Gevorg B.

Publisher: IEEE

Year: 2014

A W-band gyrotron traveling wave amplifier experiment

Type: Conference Paper

Author : He, W.; Donaldson, C.R.; Zhang, L.; McElhinney, P.; Phelps, A.D.R.; Ronald, K.; Cross, A.W.

Publisher: IEEE

Year: 2014

Measurement and Interpretation of Micro-benchmark and Application Energy Use on the Cray XC30

Type: Conference Paper

Author : Austin, B.; Wright, N.J.

Publisher: IEEE

Year: 2014

Joint Sentiment/Topic extraction from text

Type: Conference Paper

Author : Sowmiya, J.S.; Chandrakala, S.

Publisher: IEEE

Year: 2014

Stability boundary on P-V plane for analysis of short-term voltage stability

Type: Conference Paper

Author : Kawabe, Kenichi; Tanaka, Kazuyuki

Publisher: IEEE

Year: 2014

A Novel Prediction Method for Analog Circuits Based on Gaussian White Noise Estimation

Type: Conference Paper

Author : Zhou, Jingyu; Tian, Shulin; Long, Bing; Yang, Chenglin

Publisher: IEEE

Year: 2014

Parallel implementation of eigenface on CUDA

Type: Conference Paper

Author : Kawale, M.R.; Bhadke, Y.; Inamdar, V.

Publisher: IEEE

Year: 2014

Reliability investigations of large die wafer level packages: Optimization of package structure and materials to improve board level reliability

Type: Conference Paper

Author : Jarn, Markus; Hsieh, Chueh-An; Pai, Yu-Chi; Wang, Tsaiying; Hunt, John

Publisher: IEEE

Year: 2014

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Hardware-software complex of interferencing situation control and localization of electromagnetic radiation sources

SDF: A Sign Description Framework for Cross-Context Information Resource Representation and Interchange

Transformer high frequency modelling based on lumped parameter model by consideration of corelosses

A W-band gyrotron traveling wave amplifier experiment

Measurement and Interpretation of Micro-benchmark and Application Energy Use on the Cray XC30

Joint Sentiment/Topic extraction from text

Stability boundary on P-V plane for analysis of short-term voltage stability

A Novel Prediction Method for Analog Circuits Based on Gaussian White Noise Estimation

Parallel implementation of eigenface on CUDA

Reliability investigations of large die wafer level packages: Optimization of package structure and materials to improve board level reliability

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Hardware-software complex of interferencing situation control and localization of electromagnetic radiation sources

SDF: A Sign Description Framework for Cross-Context Information Resource Representation and Interchange

Transformer high frequency modelling based on lumped parameter model by consideration of corelosses

A W-band gyrotron traveling wave amplifier experiment

Measurement and Interpretation of Micro-benchmark and Application Energy Use on the Cray XC30

Joint Sentiment/Topic extraction from text

Stability boundary on P-V plane for analysis of short-term voltage stability

A Novel Prediction Method for Analog Circuits Based on Gaussian White Noise Estimation

Parallel implementation of eigenface on CUDA

Reliability investigations of large die wafer level packages: Optimization of package structure and materials to improve board level reliability