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A novel hybrid Huffman coding compression technique for secured condition monitoring of induction machine

Type: Conference Paper

Author : Das, Jinia Datta; Chowdhuri, Sumana; Bera, Jitendranath

Publisher: IEEE

Year: 2014

Influence of thermal annealing on the deformation of Cu-filled TSV

Type: Conference Paper

Author : He, Hongwen; Jing, Xiangmeng; Cao, Liqiang; Yu, Daquan; Xue, Kai; Zhang, Wenqi

Publisher: IEEE

Year: 2014

Occlusion handling in depth estimation from multiview video

Type: Conference Paper

Author : Wegner, K.; Stankiewicz, O.; Domanski, M.

Publisher: IEEE

Year: 2014

Locally linear embedding-based prediction for 3D holoscopic image coding using HEVC

Type: Conference Paper

Author : Lucas, Luis F.R.; Conti, Caroline; Nunes, Paulo; Soares, Luis Ducla; Rodrigues, Nuno M.M.; Pagliari, Carla L.; Silva, Eduardo A.B.da; de Faria, Sergio M.M.

Publisher: IEEE

Year: 2014

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A novel hybrid Huffman coding compression technique for secured condition monitoring of induction machine

Influence of thermal annealing on the deformation of Cu-filled TSV

Occlusion handling in depth estimation from multiview video

Locally linear embedding-based prediction for 3D holoscopic image coding using HEVC

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A novel hybrid Huffman coding compression technique for secured condition monitoring of induction machine

Influence of thermal annealing on the deformation of Cu-filled TSV

Occlusion handling in depth estimation from multiview video

Locally linear embedding-based prediction for 3D holoscopic image coding using HEVC