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    Cost-efficiency FFT using hardware-reduction and dynamic current scaling approaches 

    Type: Conference Paper
    Author : Chen, Ying-Liang; Hsu, Terng-Yin
    Publisher: IEEE
    Year: 2014

    Processing of EEG signals for study of coupling in brain regions for eyes open and eyes closed conditions 

    Type: Conference Paper
    Author : Bose, Deboshree; P, Ajeesh T; Dutt, D.Narayana; Tripathi, Shikha
    Publisher: IEEE
    Year: 2014

    Access control schemes for high-speed train communications 

    Type: Conference Paper
    Author : Zhou, Yuzhe; Ai, Bo
    Publisher: IEEE
    Year: 2014

    A scalable cloud computing deployment framework for efficient MapReduce operations using Apache YARN 

    Type: Conference Paper
    Author : Deni Raj, Ebin; Nivash, J.P.; Nirmala, M.; Babu, L.D Dhinesh
    Publisher: IEEE
    Year: 2014

    Spatially-Averaging Channel Estimation for Spatial Modulation 

    Type: Conference Paper
    Author : Wu, Xiping; Di Renzo, Marco; Haas, Harald
    Publisher: IEEE
    Year: 2014

    VCSELs for computer interconnects 

    Type: Conference Paper
    Author : Bimberg, D.; Li, H.; Moser, P.; Wolf, P.; Larisch, G.; Lott, J.A.
    Publisher: IEEE
    Year: 2014

    Thermal properties of interconnects in power MOSFETs 

    Type: Conference Paper
    Author : Burenkov, Alex; Baer, Eberhard; Boianceanu, Cristian
    Publisher: IEEE
    Year: 2014

    Interference Modelling Using Hierarchical Spatial Clustering of Terrain and User Density Maps 

    Type: Conference Paper
    Author : Koufos, Konstantinos; Jantti, Riku
    Publisher: IEEE
    Year: 2014

    A platform for testing monitoring systems for the power distribution grid 

    Type: Conference Paper
    Author : Sadu, A.; Angioni, A.; Junqi Liu; Ponci, F.; Monti, A.
    Publisher: IEEE
    Year: 2014

    A testbed to explore the optimal electrical stimulation parameters for suppressing inter-ictal spikes in human hippocampal slices 

    Type: Conference Paper
    Author : Min-Chi Hsiao; Pen-Ning Yu; Dong Song; Liu, C.Y.; Heck, C.N.; Millett, D.; Berger, T.W.
    Publisher: IEEE
    Year: 2014
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