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Now showing items 1-10 of 21

Industry contribution award

Type: Conference Paper

Publisher: IEEE

Year: 2014

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

Type: Conference Paper

Author : Aw, Jie Li; Chow, Alvin; Au, K.Y.; Lin, Jong-Kai

Publisher: IEEE

Year: 2014

InP double heterojunction bipolar transistor as sub-terahertz detector

Type: Conference Paper

Author : Coquillat, D.; Nodjiadjim, V.; Konczykowska, A.; Riet, M.; Dyakonova, N.; Consejo, C.; Teppe, F.; Godin, J.; Knap, W.

Publisher: IEEE

Year: 2014

Instructional Model for Building Effective Big Data Curricula for Online and Campus Education

Type: Conference Paper

Author : Demchenko, Yuri; Gruengard, Emanuel; Klous, Sander

Publisher: IEEE

Year: 2014

Demand response under real-time pricing for domestic energy system with DGs

Type: Conference Paper

Author : Ruan, Bingjie; Yang, Qiang; Fang, Xinli; Yan, Wenjun

Publisher: IEEE

Year: 2014

Peer-Assisted Content Distribution with Random Linear Network Coding

Type: Conference Paper

Author : Hundeboll, Martin; Ledet-Pedersen, Jeppe; Sluyterman, Georg; Madsen, Tatiana K.; Fitzek, Frank H.P.

Publisher: IEEE

Year: 2014

Joint sparsity-based robust visual tracking

Type: Conference Paper

Author : Bozorgtabar, Behzad; Goecke, Roland

Publisher: IEEE

Year: 2014

Performance tuning of database systems using a context-aware approach

Type: Conference Paper

Author : Nimalasena, Asanga; Getov, Vladimir

Publisher: IEEE

Year: 2014

Bad data detection in smart grid for AC model

Type: Conference Paper

Author : Vishnu Priya K P; Bapat, Jyotsna

Publisher: IEEE

Year: 2014

Increasing the Capacity of Large-Scale HetNets through Centralized Dynamic Data Offloading

Type: Conference Paper

Author : Klessig, Henrik; Gunzel, Michael; Fettweis, Gerhard

Publisher: IEEE

Year: 2014

Search

Industry contribution award

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

InP double heterojunction bipolar transistor as sub-terahertz detector

Instructional Model for Building Effective Big Data Curricula for Online and Campus Education

Demand response under real-time pricing for domestic energy system with DGs

Peer-Assisted Content Distribution with Random Linear Network Coding

Joint sparsity-based robust visual tracking

Performance tuning of database systems using a context-aware approach

Bad data detection in smart grid for AC model

Increasing the Capacity of Large-Scale HetNets through Centralized Dynamic Data Offloading

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Industry contribution award

Thermal compression bonding with non-conductive adhesive of 30&#x03BC;m pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads

InP double heterojunction bipolar transistor as sub-terahertz detector

Instructional Model for Building Effective Big Data Curricula for Online and Campus Education

Demand response under real-time pricing for domestic energy system with DGs

Peer-Assisted Content Distribution with Random Linear Network Coding

Joint sparsity-based robust visual tracking

Performance tuning of database systems using a context-aware approach

Bad data detection in smart grid for AC model

Increasing the Capacity of Large-Scale HetNets through Centralized Dynamic Data Offloading

Thermal compression bonding with non-conductive adhesive of 30μm pitch Cu pillar micro bumps on organic substrate with bare Cu bondpads