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Now showing items 1-10 of 14

On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Type: Conference Paper

Author : Kleider, John; Steenhoek, Chris

Publisher: IEEE

Year: 2014

Perceptual Image Hashing for DIBR 3D Images Based on Ring Partition and SIFT Feature Points

Type: Conference Paper

Author : Cui, Chen; Wang, Shen; Niu, Xiamu

Publisher: IEEE

Year: 2014

A thorough study of terahertz surface waves travelling along metal-dielectric surfaces of different curvature and jumping through air gaps

Type: Conference Paper

Author : Knyazev, Boris A.; Gerasimov, Vasily V.; Gorovoy, Valeriy O.; Cherkassky, Valery S.; Kulipanov, Gennady N.; Kotelnikov, Igor A.; Nikitin, Alexey K.; Zhizhin, Guerman N.

Publisher: IEEE

Year: 2014

UWB 2D communication tiles

Type: Conference Paper

Author : Shinoda, Hiroyuki; Okada, Akimasa; Noda, Akihito

Publisher: IEEE

Year: 2014

Generalized virtual networking: An enabler for service centric networking and network function virtualization

Type: Conference Paper

Author : Salsano, Stefano; Blefari-Melazzi, Nicola; Presti, Francesco Lo; Siracusano, Giuseppe; Ventre, Pier Luigi

Publisher: IEEE

Year: 2014

Evaluation of a face recognition system performance's variation on a citizen passports database

Type: Conference Paper

Author : Lema, Gabriel; Di Martino, Luis; Berchesi, Sebastian; Fernandez, Alicia; Lecumberry, Federico; Preciozzi, Javier

Publisher: IEEE

Year: 2014

Definition of Software Process Lines for Integration of Scrum and CMMI

Type: Conference Paper

Author : Dias de Carvalho, Daniel; Chagas, Larissa Fernandes; Reis, Carla Alessandra Lima

Publisher: IEEE

Year: 2014

Extracting product features from online reviews based on two-level HHMM

Type: Conference Paper

Author : Wang, Xiaoli; Lu, Zhang

Publisher: IEEE

Year: 2014

Study on evaluation method for polishing pad surface topography based on optical fourier transform

Type: Conference Paper

Author : Khajornrungruang, Panart; Suzuki, Keisuke; Kushida, Takashi; Tajiri, Takahiro; Matsuo, Hisanori; Mochizuki, Yoshihiro; Hiyama, Hirokuni; Kimura, Keiichi

Publisher: IEEE

Year: 2014

Correlation of large particle count data in CMP slurry with production wafer defects

Type: Conference Paper

Author : Bennett, J.; Fury, M.A.

Publisher: IEEE

Year: 2014

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On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Perceptual Image Hashing for DIBR 3D Images Based on Ring Partition and SIFT Feature Points

A thorough study of terahertz surface waves travelling along metal-dielectric surfaces of different curvature and jumping through air gaps

UWB 2D communication tiles

Generalized virtual networking: An enabler for service centric networking and network function virtualization

Evaluation of a face recognition system performance's variation on a citizen passports database

Definition of Software Process Lines for Integration of Scrum and CMMI

Extracting product features from online reviews based on two-level HHMM

Study on evaluation method for polishing pad surface topography based on optical fourier transform

Correlation of large particle count data in CMP slurry with production wafer defects

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On the Performance of Variable Fractional Delay Arbitrary Sample Rate Conversion for Digital Signals

Perceptual Image Hashing for DIBR 3D Images Based on Ring Partition and SIFT Feature Points

A thorough study of terahertz surface waves travelling along metal-dielectric surfaces of different curvature and jumping through air gaps

UWB 2D communication tiles

Generalized virtual networking: An enabler for service centric networking and network function virtualization

Evaluation of a face recognition system performance's variation on a citizen passports database

Definition of Software Process Lines for Integration of Scrum and CMMI

Extracting product features from online reviews based on two-level HHMM

Study on evaluation method for polishing pad surface topography based on optical fourier transform

Correlation of large particle count data in CMP slurry with production wafer defects