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    FETD applied to EM scattering by arbitrary shape cylinder 

    Type: Conference Paper
    Author : Li Linqian; Yang Qian; Wei Bing; Cao Le; Ge Debiao
    Publisher: IEEE
    Year: 2014

    A light-weight SIP-based execution management service for bag-of-tasks grid system 

    Type: Conference Paper
    Author : Basicevic, Ilija; Cetic, Nenad; Popovic, Miroslav; Krunic, Momcilo
    Publisher: IEEE
    Year: 2014

    The influence of SiC/SiO<inf>2</inf> interface morphology on the electrical characteristics of SiC MOS structures 

    Type: Conference Paper
    Author : Liu, L.; Jiao, C.; Xu, Y.; Liu, G.; Feldman, L.C.; Dhar, S.
    Publisher: IEEE
    Year: 2014

    Front matter 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Efficient setup for the measurement of transmission-coefficients with a single-room anechoic chamber 

    Type: Conference Paper
    Author : Niembro-Martin, Alejandro; Pistono, Emmanuel; Lemaitre-Auger, Pierre; Vuong, Tan-Phu; Tourtollet, Guy Eymin Petot
    Publisher: IEEE
    Year: 2014

    MATLAB tools for the analysis of Petri net models 

    Type: Conference Paper
    Author : Julvez, Jorge; Matcovschi, Mihaela H.; Pastravanu, Octavian
    Publisher: IEEE
    Year: 2014

    SWAPN: A dream tool for the visually challenged 

    Type: Conference Paper
    Author : Saravanan, M; Bhavani; Dhaksshayani; Vineet, G
    Publisher: IEEE
    Year: 2014

    Electrospun silk doped with selenium for antibacterial skin applications 

    Type: Conference Paper
    Author : Chung, Stanley; Ercan, Batur; Webster, Thomas J.; Tran, Phong
    Publisher: IEEE
    Year: 2014

    Capturing color and near-infrared images with different exposure times for image enhancement under extremely low-light scene 

    Type: Conference Paper
    Author : Mikami, Takuya; Sugimura, Daisuke; Hamamoto, Takayuki
    Publisher: IEEE
    Year: 2014

    On computation of the radial magnetic field in vacuum interrupters 

    Type: Conference Paper
    Author : Bhat, R.; Kulkarni, S.V.; Kulkarni, S.; Hemachander, M.
    Publisher: IEEE
    Year: 2014
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