Search

Now showing items 1-10 of 93

2.5D through silicon interposer package fabrication by chip-on-wafer (CoW) approach

Type: Conference Paper

Author : Ho, S.W.; Ding, Mian Zhi; Lim, Pei Siang; Cereno, Daniel Ismail; Katti, Guruprasad; Chai, Tai Chong; Bhattacharya, Surya

Publisher: IEEE

Year: 2014

3D Sketch System Based on Life-Sized and Operable Concept Enhanced by Three Design Spaces

Type: Conference Paper

Publisher: IEEE

Year: 2014

Tightly coupling GPS with lane markings for autonomous vehicle navigation

Type: Conference Paper

Author : Tao, Zui; Bonnifait, Philippe

Publisher: IEEE

Year: 2014

A fusion-based enhancing approach for single sandstorm image

Type: Conference Paper

Author : Fu, Xueyang; Huang, Yue; Zeng, Delu; Zhang, Xiao-Ping; Ding, Xinghao

Publisher: IEEE

Year: 2014

Multi-view action recognition by cross-domain learning

Type: Conference Paper

Author : Nie, Weizhi; Liu, Anan; Yu, Jing; Su, Yuting; Chaisorn, Lekha; Wang, Yongkang; Kankanhalli, Mohan S

Publisher: IEEE

Year: 2014

Methods for measuring the wavelength of the flat metal-dielectric waveguides

Type: Conference Paper

Author : Afonin, I.L.; Bugayov, P.A.; Bokov, G.V.

Publisher: IEEE

Year: 2014

Choice of parameters of weight functions at spectral processing of signals of microwave level gauges with frequency modulation

Type: Conference Paper

Author : Davidochkin, V.M.

Publisher: IEEE

Year: 2014

The integral model of the second type characteristic functions of 3D teragertz FMCW radar

Type: Conference Paper

Author : Ksovets, M.; Tovstenko, L.

Publisher: IEEE

Year: 2014

The electromagnetic screen-restructor

Type: Conference Paper

Author : Plaksin, S.V.; Sokolovskiy, I.I.; Pogorelaya, L.M.; Prokhorov, V.A.; Yashin, S.A.

Publisher: IEEE

Year: 2014

Cathode spot motion in a vacuum arc with a long roof-shaped cathode

Type: Conference Paper

Author : Beilis, I.I.; Sagi, B.; Zhitomirsky, V.; Boxman, R.L.

Publisher: IEEE

Year: 2014

1
2
3
4
. . .
10

Search

2.5D through silicon interposer package fabrication by chip-on-wafer (CoW) approach

3D Sketch System Based on Life-Sized and Operable Concept Enhanced by Three Design Spaces

Tightly coupling GPS with lane markings for autonomous vehicle navigation

A fusion-based enhancing approach for single sandstorm image

Multi-view action recognition by cross-domain learning

Methods for measuring the wavelength of the flat metal-dielectric waveguides

Choice of parameters of weight functions at spectral processing of signals of microwave level gauges with frequency modulation

The integral model of the second type characteristic functions of 3D teragertz FMCW radar

The electromagnetic screen-restructor

Cathode spot motion in a vacuum arc with a long roof-shaped cathode

Author

Publisher

Year

Keywords

Type

Language (ISO)

Content Type

Publication Title

Search

Filters

2.5D through silicon interposer package fabrication by chip-on-wafer (CoW) approach

3D Sketch System Based on Life-Sized and Operable Concept Enhanced by Three Design Spaces

Tightly coupling GPS with lane markings for autonomous vehicle navigation

A fusion-based enhancing approach for single sandstorm image

Multi-view action recognition by cross-domain learning

Methods for measuring the wavelength of the flat metal-dielectric waveguides

Choice of parameters of weight functions at spectral processing of signals of microwave level gauges with frequency modulation

The integral model of the second type characteristic functions of 3D teragertz FMCW radar

The electromagnetic screen-restructor

Cathode spot motion in a vacuum arc with a long roof-shaped cathode