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Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

Type: Conference Paper

Author : Chen, Zhaohui; Jung, Boo Yang; Lim, Sharon Pei Siang; Dexter, Sorono Velez; Ho, David Soon Wee; Zhang, Xiaowu

Publisher: IEEE

Year: 2014

Sum of squares based nonlinear control design for diesel engine

Type: Conference Paper

Author : Kuzmych, Olena; Hajjaji, Ahmed El; Aitouche, Abdel; Bosche, Jerome

Publisher: IEEE

Year: 2014

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

Type: Conference Paper

Author : Agapiou, George; Papafili, Ioanna; Agapiou, Stelios

Publisher: IEEE

Year: 2014

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

Type: Conference Paper

Author : Chatterjee, Krishnendu; Pavlogiannis, Andreas; Kossler, Alexander; Schmid, Ulrich

Publisher: IEEE

Year: 2014

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

Type: Conference Paper

Author : Schellenberg, Sebastian; Berndt, Rudiger; Eckhoff, David; German, Reinhard

Publisher: IEEE

Year: 2014

Modelling DC offset in fault currents recorded by intelligent electronic devices

Type: Conference Paper

Author : Zivanovic, Rastko

Publisher: IEEE

Year: 2014

Adaptive Transmit Power for Wi-Fi Dense Deployments

Type: Conference Paper

Author : Chaves, Fabiano S.; Cavalcante, Andre M.; Almeida, Erika P.L.; Abinader, Fuad M.; Vieira, Robson D.; Choudhury, Sayantan; Doppler, Klaus

Publisher: IEEE

Year: 2014

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM

Type: Conference Paper

Author : Li, Zhong-zheng; Shi, Li-ming; Shi, Sheng-guo; Zhang, Song

Publisher: IEEE

Year: 2014

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

Type: Conference Paper

Author : Brusaferri, Alessandro; Ballarino, Andrea; Cavadini, Franco Antonio; Manzocchi, Diego; Mazzolini, Mauro

Publisher: IEEE

Year: 2014

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

Type: Conference Paper

Author : Farbiz, Farzan; Salman, Akram A.

Publisher: IEEE

Year: 2014

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Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

Sum of squares based nonlinear control design for diesel engine

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

Modelling DC offset in fault currents recorded by intelligent electronic devices

Adaptive Transmit Power for Wi-Fi Dense Deployments

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

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Thermo-mechanical reliability study on Package on Package (PoP) with Embedded Wafer Level Package (eWLP)

Sum of squares based nonlinear control design for diesel engine

The role of SDN and NFV for dynamic bandwidth allocation and QoE adaptation of video applications in home networks

A Framework for Automated Competitive Analysis of On-line Scheduling of Firm-Deadline Tasks

A Computationally Inexpensive Battery Model for the Microscopic Simulation of Electric Vehicles

Modelling DC offset in fault currents recorded by intelligent electronic devices

Adaptive Transmit Power for Wi-Fi Dense Deployments

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM&#x002B;BEM

CPS-based hierarchical and self-similar automation architecture for the control and verification of reconfigurable manufacturing systems

Multi-reflection TLP: A new measurement technique for system-level automotive ESD/EMC characterization

Study on thefinite elastic plate'snear-field acoustic characteristicsby FEM+BEM