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Thermal-aware task scheduling for peak temperature minimization under periodic constraint for 3D-MPSoCs
Publisher: IEEE
Year: 2014
TSV-to-TSV inductive coupling-aware coding scheme for 3D Network-on-Chip
Publisher: IEEE
Year: 2014
Security impact assessment of industrial automation systems using genetic algorithm and simulation
Publisher: IEEE
Year: 2014
Introducing a new method for FDTD modeling of electromagnetic wave propagation in magnetized plasma
Publisher: IEEE
Year: 2014
Comparative analysis of sparse signal recovery algorithms based on minimization norms
Publisher: IEEE
Year: 2014