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    OLDA based online handwriting recogntion 

    Type: Conference Paper
    Author : Prasad, M.M.
    Publisher: IEEE
    Year: 2014

    User experience of mobile augmented reality: A review of studies 

    Type: Conference Paper
    Author : Irshad, Shafaq; Rohaya Bt Awang Rambli, Dayang
    Publisher: IEEE
    Year: 2014

    High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In 

    Type: Conference Paper
    Author : Aasmundtveit, Knut E.; Luu, Thi-Thuy; Vardoy, Astrid-Sofie B.; Tollefsen, Torleif A.; Wang, Kaiying; Hoivik, Nils
    Publisher: IEEE
    Year: 2014

    Soft magnetic material degradation due to manufacturing process: A comparison of measurements and numerical simulations 

    Type: Conference Paper
    Author : von Pfingsten, G.; Steentjes, S.; Thul, A.; Herold, T.; Hameyer, K.
    Publisher: IEEE
    Year: 2014

    A study on estimation of planar gait kinematics using minimal inertial measurement units and inverse kinematics 

    Type: Conference Paper
    Author : Xinyao Hu; Gim Song Soh
    Publisher: IEEE
    Year: 2014

    Security analysis of TLS authentication 

    Type: Conference Paper
    Author : Ranjan, A.K.; Kumar, V.; Hussain, M.
    Publisher: IEEE
    Year: 2014

    Measurement and Modeling of the LTE Train-Ground Channel for High-Speed Railway in Viaduct Scenario 

    Type: Conference Paper
    Author : Zhao, Ruojun; Wu, Muqing; Xiang, Xiao; Yang, Jiaqi
    Publisher: IEEE
    Year: 2014

    Research on the Hardware-in-Loop Simulation Platform of OBDH 

    Type: Conference Paper
    Author : Lianxiang, Jiang; Feng, Zhan; Mingrui, Xin; Jingjing, Li; Ruiyuan, Pan
    Publisher: IEEE
    Year: 2014

    Two-Phase Attribute Ordering for Unsupervised Ranking of Multi-attribute Objects 

    Type: Conference Paper
    Author : Li, Chun-Guo; Mei, Xing; Hu, Bao-Gang
    Publisher: IEEE
    Year: 2014

    Rate distortion optimized quantization based on weighted mean squared error for lossy image coding 

    Type: Conference Paper
    Author : He, Da-ke; Wang, Jing
    Publisher: IEEE
    Year: 2014
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