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Speaker identification in shouted talking environments based on novel Third-Order Hidden Markov Models

Type: Conference Paper

Author : Shahin, Ismail

Publisher: IEEE

Year: 2014

Contiguously clustered linear arrays through Bayesian compressive sensing

Type: Conference Paper

Author : Bekele, Ephrem T.; Oliveri, Giacomo; Massa, Andrea

Publisher: IEEE

Year: 2014

Enabling genomic analysis on federated clouds

Type: Conference Paper

Author : Jiang, Fan; Shoffner, Michael; Castillo, Claris; Schmitt, Charles

Publisher: IEEE

Year: 2014

Universal high-temperature suitable joint adapting diffusion soldering

Type: Conference Paper

Author : Strogies, Joerg; Wilke, Klaus

Publisher: IEEE

Year: 2014

VLSI architecture of HEVC intra prediction for 8K UHDTV applications

Type: Conference Paper

Author : Zhou, Jianbin; Zhou, Dajiang; Sun, Heming; Goto, Satoshi

Publisher: IEEE

Year: 2014

CMOS compatible fabrication of flexible and semi-transparent FeRAM on ultra-thin bulk monocrystalline silicon (100) fabric

Type: Conference Paper

Author : Ghoneim, Mohamed T.; Hanna, Amir N.; Hussain, Muhammad M.

Publisher: IEEE

Year: 2014

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Speaker identification in shouted talking environments based on novel Third-Order Hidden Markov Models

Contiguously clustered linear arrays through Bayesian compressive sensing

Enabling genomic analysis on federated clouds

Universal high-temperature suitable joint adapting diffusion soldering

VLSI architecture of HEVC intra prediction for 8K UHDTV applications

CMOS compatible fabrication of flexible and semi-transparent FeRAM on ultra-thin bulk monocrystalline silicon (100) fabric

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Speaker identification in shouted talking environments based on novel Third-Order Hidden Markov Models

Contiguously clustered linear arrays through Bayesian compressive sensing

Enabling genomic analysis on federated clouds

Universal high-temperature suitable joint adapting diffusion soldering

VLSI architecture of HEVC intra prediction for 8K UHDTV applications

CMOS compatible fabrication of flexible and semi-transparent FeRAM on ultra-thin bulk monocrystalline silicon (100) fabric