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An optimal probing method of pre-bond TSV fault identification in 3D stacked ICs
Publisher: IEEE
Year: 2014
Integrated superlattices and metamaterials
Publisher: IEEE
Year: 2014
Wind turbine inverse control: A bond graph approach
Publisher: IEEE
Year: 2014
Effective penetration testing with Metasploit framework and methodologies
Publisher: IEEE
Year: 2014
An E-Commerce model based on a multi-agent technology
Publisher: IEEE
Year: 2014
BIOSIG 2014 — Biometrics special interest group
Publisher: IEEE
Year: 2014
Analysis of effective fuzzy-CAC solution for proactive traffic engineering
Publisher: IEEE
Year: 2014
Vehicles as Big Data Carriers: Road Map Space Reduction and Efficient Data Assignment
Publisher: IEEE
Year: 2014