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Chip package interaction induced ILD integrity issues in fine pitch flip chip packages
Publisher: IEEE
Year: 2014
Expressive speech analysis for story telling application
Publisher: IEEE
Year: 2014
Applications of microfluidics for studying growth mechanisms of tip growing pollen tubes
Publisher: IEEE
Year: 2014
The analysis of integral characteristics of received signal envelope in wireless mobile communications
Publisher: IEEE
Year: 2014
Symbolic regression methods for control system synthesis
Publisher: IEEE
Year: 2014
Model of the speckle noise forprocessing of SAR images
Publisher: IEEE
Year: 2014
Quantifying Information Flow for Dynamic Secrets
Publisher: IEEE
Year: 2014
Multimodal classification with deformable part-based models for urban cartography
Publisher: IEEE
Year: 2014