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Estimation of the number of crop seeds based on image identification

Type: Conference Paper

Author : Li Pengfei; Meng Qi; Zhang Weihong

Publisher: IEEE

Year: 2014

Dyke Award - Ffor distinguished work on discharges and electrical insulation in vacuum

Type: Conference Paper

Publisher: IEEE

Year: 2014

Physical properties and biocompatibility of acemannan scaffold for biomedical applications

Type: Conference Paper

Author : Boonyagul, S.; Thunyakitpisal, P.; Tachaboonyakiat, W.

Publisher: IEEE

Year: 2014

RSSI-based positioning for health care service using artificial neural network approach

Type: Conference Paper

Author : Otarawanna, P.; Charoensuk, W.

Publisher: IEEE

Year: 2014

Dynamic representation method of target in remote sensed images based on global subdivision grid

Type: Conference Paper

Author : Jing Yan; Cheng Chengqi

Publisher: IEEE

Year: 2014

Author

Boonyagul, S. (1)

Charoensuk, W. (1)

Cheng Chengqi (1)

Jing Yan (1)

Li Pengfei (1)

Meng Qi (1)

Otarawanna, P. (1)

Tachaboonyakiat, W. (1)

Thunyakitpisal, P. (1)

Zhang Weihong (1)

Publisher

IEEE (5)

Year

2014 (5)

Keywords

n three-dimensional integrated circuits (5)

n TSV fabrication (3)

copper (2)

n Cu (2)

n integrated circuit manufacture (2)

catalysts (1)

CMOS image sensors (1)

liquid metals (1)

n 2.5D Si integration (1)

n 2.5D silicon interposers (1)

Type

Conference Paper (5)

Language (ISO)

English (5)

Content Type

Metadata Only (5)

Publication Title

iomedical Engineering International Conference (BMEiCON), 2014 7th (2)

eoscience and Remote Sensing Symposium (IGARSS), 2014 IEEE International (1)

ischarges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on (1)

omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE (1)

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