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Fully functional fine-grain vertically integrated 3D focal plane neuromorphic processor
Publisher: IEEE
Year: 2014
Comprehensive study on reliability of chip-package interaction using Cu pillar joint onto low k chip
Publisher: IEEE
Year: 2014
Performance Comparison of Major Classical Face Recognition Techniques
Publisher: IEEE
Year: 2014
Integrated electronic and microfluidic packaging for CMOS biosensor chip
Publisher: IEEE
Year: 2014
Low Complexity Target Coverage Heuristics Using Mobile Cameras
Publisher: IEEE
Year: 2014
Synthetic aperture approach to microwave holographic image improvement
Publisher: IEEE
Year: 2014
Improvement of miniaturized olfactory display using electroosmotic pumps and SAW device
Publisher: IEEE
Year: 2014
The formation of the pattern radar images of ships using a limited set of experimental data
Publisher: IEEE
Year: 2014
DFIG based wind turbine system modeling in the Real Time Digital Simulator
Publisher: IEEE
Year: 2014
Application of null space method in computing electricity prices with voltage-stability constraints
Publisher: IEEE
Year: 2014