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Bondability and challenges of Cu ultra-fine-wire bonding

Type: Conference Paper

Author : Sutiono, Sylvia; Zhangxi; Wei, Tok Chee; An, Don Syth; Sarangapani, Murali; Huang, Louie; Hung, Jason; Lin, Frank

Publisher: IEEE

Year: 2014

Face and texture analysis using local descriptors: A comparative analysis

Type: Conference Paper

Author : Hadid, Abdenour; Ylioinas, Juha; Lopez, Miguel Bordallo

Publisher: IEEE

Year: 2014

Fabrication of a poly(piperazine-amide)/polysulfone hollow fiber membrane for effective removal of heavy metals in industrial wastewater

Type: Conference Paper

Author : Zhao, Kexiang

Publisher: IEEE

Year: 2014

A comparative performance analysis of C-Si and A-Si PV based rooftop grid tied solar photovoltaic systems in Jodhpur

Type: Conference Paper

Author : Singh, V.P.; Ravindra, B.; Vijay, V.; Bhatt, M.S.

Publisher: IEEE

Year: 2014

A modified hybrid multi-level converter for high-power high-frequency IPT systems

Type: Conference Paper

Author : Rahnamaee, Hamid Reza; Madawala, Udaya K.; Thrimawithana, Duleepa J.

Publisher: IEEE

Year: 2014

A new method of approximatin for computing failure frequecy of system

Type: Conference Paper

Author : Hayashi, M.

Publisher: IEEE

Year: 2014

Map 2

Type: Conference Paper

Publisher: IEEE

Year: 2014

Assessment of resistance of AlAs/GaAs nanoscale heterostructures of resonant-tunneling diodes to diffusion destruction by means of IR-spectroscopic ellipsometry

Type: Conference Paper

Author : Makeev, M.O.; Ivanov, Yu.A.; Sinyakin, V.Yu.; Meshkov, S.A.; Agasieva, S.V.; Shashurin, V.D.

Publisher: IEEE

Year: 2014

Study of cooperative MIMO method effectiveness for HF communication system

Type: Conference Paper

Author : Averina, L.I.; Maljutin, A.A.; Merkulov, D.V.; Doroshenko, V.Ju.

Publisher: IEEE

Year: 2014

Estimating the effect of single-event upsets on microprocessors

Type: Conference Paper

Author : Constantinescu, Cristian; Krishnamoorthy, Srini; Nguyen, Tuyen

Publisher: IEEE

Year: 2014

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Bondability and challenges of Cu ultra-fine-wire bonding

Face and texture analysis using local descriptors: A comparative analysis

Fabrication of a poly(piperazine-amide)/polysulfone hollow fiber membrane for effective removal of heavy metals in industrial wastewater

A comparative performance analysis of C-Si and A-Si PV based rooftop grid tied solar photovoltaic systems in Jodhpur

A modified hybrid multi-level converter for high-power high-frequency IPT systems

A new method of approximatin for computing failure frequecy of system

Map 2

Assessment of resistance of AlAs/GaAs nanoscale heterostructures of resonant-tunneling diodes to diffusion destruction by means of IR-spectroscopic ellipsometry

Study of cooperative MIMO method effectiveness for HF communication system

Estimating the effect of single-event upsets on microprocessors

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Bondability and challenges of Cu ultra-fine-wire bonding

Face and texture analysis using local descriptors: A comparative analysis

Fabrication of a poly(piperazine-amide)/polysulfone hollow fiber membrane for effective removal of heavy metals in industrial wastewater

A comparative performance analysis of C-Si and A-Si PV based rooftop grid tied solar photovoltaic systems in Jodhpur

A modified hybrid multi-level converter for high-power high-frequency IPT systems

A new method of approximatin for computing failure frequecy of system

Map 2

Assessment of resistance of AlAs/GaAs nanoscale heterostructures of resonant-tunneling diodes to diffusion destruction by means of IR-spectroscopic ellipsometry

Study of cooperative MIMO method effectiveness for HF communication system

Estimating the effect of single-event upsets on microprocessors