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From simulations to interactive numerical laboratories
Publisher: IEEE
Year: 2014
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Publisher: IEEE
Year: 2014
AR-concepts for hermetic wafer level packaging of uncooled FIR bolometer arrays
Publisher: IEEE
Year: 2014
Comparison between optimal interconnection network in different 2D and 3D NoC structures
Publisher: IEEE
Year: 2014
Technical program committee
Publisher: IEEE
Year: 2014
Smart textile-based protective system for firefighters
Publisher: IEEE
Year: 2014
Investigation of soil contamination by iron pipe corrosion and its influence on GPR detection
Publisher: IEEE
Year: 2014
Health Information Exchange for Home-Based Chronic Disease Self-Management -- A Hybrid Cloud Approach
Publisher: IEEE
Year: 2014
Optimal placement of voltage sag monitors based on fault location principle
Publisher: IEEE
Year: 2014