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Development of underfilling and thermo-compression bonding processes for stacking multi-layer 3D ICs

Type: Conference Paper

Author : Wang, Teng; Daily, Robert; Capuz, Giovanni; Gerets, Carine; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric

Publisher: IEEE

Year: 2014

The analysis of the paralel coupling behaviour, for pumps with identical or different characteristics

Type: Conference Paper

Author : Popescu, Daniela; Bratu, Cristian; Duinea, Adelaida Mihaela

Publisher: IEEE

Year: 2014

Author

Beyer, Gerald (1)

Beyne, Eric (1)

Bratu, Cristian (1)

Capuz, Giovanni (1)

Daily, Robert (1)

Duinea, Adelaida Mihaela (1)

Gerets, Carine (1)

Miller, Andy (1)

Popescu, Daniela (1)

Rebibis, Kenneth June (1)

Publisher

IEEE (2)

Year

2014 (2)

Keywords

n Integrated circu (2)

integrated circuit design (1)

maximum power point trackers (1)

n 3D interposer technology (1)

n Arrays (1)

n Bandwidth (1)

n Biological system modeling (1)

n chip-to-chip interconnection (1)

n Computational modeling (1)

n DC DC boost converter (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

Content Type

Metadata Only (2)

Publication Title

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

pplied and Theoretical Electricity (ICATE), 2014 International Conference on (1)

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