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Evaluation and optimization of the mechanical strength of bonds between metal foil and aluminium pads on thin ASICs using gold ball studs as micro-rivets

Type: Conference Paper

Author : Giagka, Vasiliki; Vanhoestenberghe, Anne; Donaldson, Nick; Demosthenous, Andreas

Publisher: IEEE

Year: 2014

Linear System Solvability in the Virtual Money Exchange Rate Algorithm

Type: Conference Paper

Author : Bingqing Shen; Jingzhi Guo; Chen, C.L.P.

Publisher: IEEE

Year: 2014

Effect of thermal annealing in vacuum on the structural and optical properties of Sb<inf>2</inf>S<inf>3</inf> thin films

Type: Conference Paper

Author : Tigau, Nicolae; Condurache-Bota, Simona

Publisher: IEEE

Year: 2014

Implementation of leader development models in ATP-EMTP Using a type-94 circuit component

Type: Conference Paper

Author : Datsios, Zacharias G.; Mikropoulos, Pantelis N.

Publisher: IEEE

Year: 2014

Author

Bingqing Shen (1)

Chen, C.L.P. (1)

Condurache-Bota, Simona (1)

Datsios, Zacharias G. (1)

Demosthenous, Andreas (1)

Donaldson, Nick (1)

Giagka, Vasiliki (1)

Jingzhi Guo (1)

Mikropoulos, Pantelis N. (1)

Tigau, Nicolae (1)

Publisher

IEEE (4)

Year

2014 (4)

Keywords

aluminium (1)

Big Data (1)

computer viruses (1)

n 2-wall metallic Whipple shield (1)

n aggregation optimizing (1)

n Algorithm design and analysis (1)

n Architecture (1)

n Attack (1)

n ballistic limit equation (1)

n baseline SPP configuration (1)

Type

Conference Paper (4)

Language (ISO)

English (4)

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Metadata Only (4)

Publication Title

emiconductor Conference (CAS), 2014 International (1)

ightning Protection (ICLP), 2014 International Conference o (1)

lectronics System-Integration Technology Conference (ESTC), 2014 (1)

nterprise Systems Conference (ES), 2014 (1)

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