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Now showing items 1-10 of 36
Thermo-compression bonding for 2.5D fine pitch copper pillar bump interconnections on TSV interposer
Publisher: IEEE
Year: 2014
Small signal modelling and stability analysis of an islanded AC microgrid with inverter interfaced DGs
Publisher: IEEE
Year: 2014
Optimization and modeling of resonant clocking inductors for the POWER8<sup>TM</sup> microprocessor
Publisher: IEEE
Year: 2014
Simulation of synchronous boost MPPT converter with GaN switches for photovoltaics
Publisher: IEEE
Year: 2014
Analyzing passenger density for public bus: Inference of crowdedness and evaluation of scheduling choices
Publisher: IEEE
Year: 2014
Frequency-domain approach to calculate steady-state of a stand-alone photovoltaic system
Publisher: IEEE
Year: 2014