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Now showing items 1-10 of 115

Dynamic placement of virtualized resources for data centers in cloud

Type: Conference Paper

Author : Usmin, S.; Irudayaraja, M.Arockia; Muthaiah, U.

Publisher: IEEE

Year: 2014

Adaptive Block level management for hybrid main memory

Type: Conference Paper

Author : Renhua Yang; Xiaoyong Xue; Yufeng Xie; Yinyin Lin

Publisher: IEEE

Year: 2014

Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Type: Conference Paper

Author : HungYang, Leong; BoonKar, Yap; Yong, Tan Chou; Khan, Navas; Ibrahim, Mohd Rusli; Tan, L.C.

Publisher: IEEE

Year: 2014

Traffic Aware Wireless Sensor Networks MAC Protocol for Smart Grid Applications Using Spiral Backoff Mechanism

Type: Conference Paper

Author : Ahmed, Musse Mohamud; Bari, S.M.Sadakatul; Habaebi, Mohamed Hadi; Khan, Sheroz; Anwar, Farhat

Publisher: IEEE

Year: 2014

Reducing Communication in Parallel Breadth-First Search on Distributed Memory Systems

Type: Conference Paper

Author : Lu, Huiwei; Tan, Guangming; Chen, Mingyu; Sun, Ninghui

Publisher: IEEE

Year: 2014

Message from BDCloud Chairs

Type: Conference Paper

Publisher: IEEE

Year: 2014

3D TCAD simulation of single-event-effect in n-channel transistor based on deep sub-micron fully-depleted silicon-on-insulator technology

Type: Conference Paper

Author : Jinshun Bi; Bo Li; Zhengsheng Han; Jiajun Luo; Li Chen; Xuefang Lin-Shi

Publisher: IEEE

Year: 2014

Full composite fractal antenna with dual band used for wireless applications

Type: Conference Paper

Author : Choudhary, Ruchika; Yadav, Sanjeev; Jain, Pushpanjali; Sharma, M.M.

Publisher: IEEE

Year: 2014

A scalable framework for large-scale analysis of gene-gene interactions

Type: Conference Paper

Author : Hmida, Moez Ben Haj; Slimani, Yahya

Publisher: IEEE

Year: 2014

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Type: Conference Paper

Publisher: IEEE

Year: 2014

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Dynamic placement of virtualized resources for data centers in cloud

Adaptive Block level management for hybrid main memory

Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Traffic Aware Wireless Sensor Networks MAC Protocol for Smart Grid Applications Using Spiral Backoff Mechanism

Reducing Communication in Parallel Breadth-First Search on Distributed Memory Systems

Message from BDCloud Chairs

3D TCAD simulation of single-event-effect in n-channel transistor based on deep sub-micron fully-depleted silicon-on-insulator technology

Full composite fractal antenna with dual band used for wireless applications

A scalable framework for large-scale analysis of gene-gene interactions

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Dynamic placement of virtualized resources for data centers in cloud

Adaptive Block level management for hybrid main memory

Manufacturability readiness of insulated Cu wire bonding process in PBGA package

Traffic Aware Wireless Sensor Networks MAC Protocol for Smart Grid Applications Using Spiral Backoff Mechanism

Reducing Communication in Parallel Breadth-First Search on Distributed Memory Systems

Message from BDCloud Chairs

3D TCAD simulation of single-event-effect in n-channel transistor based on deep sub-micron fully-depleted silicon-on-insulator technology

Full composite fractal antenna with dual band used for wireless applications

A scalable framework for large-scale analysis of gene-gene interactions

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