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    Empirical Evaluation of Modeling Languages Using Multi-Lift System Case Study 

    Type: Conference Paper
    Author : عباس رسول زادگان; Ahmad Abdollahzadeh Barforoush; Abbas Rasoolzadegan
    Year: 2011
    Abstract:

    This paper empirically investigates the advantages and limitations of modeling languages by specifying the multi-lift system as a non-trivial case study. The multi-lift system is a suitable test bed to demonstrate the

    expressive power...

    Demonstration of Germanium nMOSFETs with interface passivation of ozone pre-gate treatment and ozone ambient annealing 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Multi-harmonic absorption filter using quasi-multilayered striplines 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    The relational degree model based on curvature and application 

    Type: Conference Paper
    Author : Wu Honghua , Mu Yong , Deng Lixia
    Publisher: IEEE
    Year: 2014

    Adaptive Registration of Very Large Images 

    Type: Conference Paper
    Author : Jackson, Brian P. , Goshtasby, A.Ardeshir
    Publisher: IEEE
    Year: 2014

    Building profiles based on ontology for career recommendation in E-learning context 

    Type: Conference Paper
    Author : Alimam, M.A. , Seghiouer, H. , Elyusufi, Y.
    Publisher: IEEE
    Year: 2014

    Effective license plate detection using fast candidate region selection and covariance feature based filtering 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    3D rectangular waveguide integrated in embedded Wafer Level Ball Grid Array (eWLB) package 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Study of fine pitch micro-interconnections formed by low temperature bonded copper nanowires based anisotropic conductive film 

    Type: Conference Paper
    Author : Jing Tao , Mathewson, A. , Razeeb, K.M.
    Publisher: IEEE
    Year: 2014

    A Safety Food Consumption Mobile System through Semantic Web Technology 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014
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