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    Material characterization of a novel lead-free solder material — SACQ 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Preparation and characterization of MWCNT dispersed in various solutions 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    New Normalised Bayesian smoothers for signals modelled by non-causal compositions of reciprocal chains 

    Type: Conference Paper
    Author : White, L.B. , Carravetta, F.
    Publisher: IEEE
    Year: 2014

    An MDL Algorithm for Detecting More Sources Than Sensors Using Outer-Products of Array Output 

    Type: Journal Paper
    Author : Qi Cheng; Pal, Parama; Tsuji, Mineo; Yingbo Hua
    Publisher: IEEE
    Year: 2014

    M2MSec'14: Workshop on security and privacy in machine-to-machine communications (M2MSec'14) - Committees and welcome 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Unified, ultra compact, quadratic power proxies for multi-core processors 

    Type: Conference Paper
    Author : Yasin, M. , Shahrour, A. , Elfadel, I.M.
    Publisher: IEEE
    Year: 2014

    Automatic Detection of the Number of Raypaths in a Shallow-Water Waveguide 

    Type: Journal Paper
    Author : Longyu Jiang; Mars, Jerome /I/.
    Publisher: IEEE
    Year: 2014

    Design and characterization of embedded microheater on CMOS-MEMS resonator for application in mass-sensitive gas sensors 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    [Title page] 

    Type: Conference Paper
    Publisher: IEEE
    Year: 2014

    Development of a high density glass interposer based on wafer level packaging technologies 

    Type: Conference Paper
    Author : To&#x0308
    Publisher: IEEE
    Year: 2014
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