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Now showing items 1-10 of 17
Material characterization of a novel lead-free solder material — SACQ
Publisher: IEEE
Year: 2014
Preparation and characterization of MWCNT dispersed in various solutions
Publisher: IEEE
Year: 2014
New Normalised Bayesian smoothers for signals modelled by non-causal compositions of reciprocal chains
Publisher: IEEE
Year: 2014
An MDL Algorithm for Detecting More Sources Than Sensors Using Outer-Products of Array Output
Publisher: IEEE
Year: 2014
Unified, ultra compact, quadratic power proxies for multi-core processors
Publisher: IEEE
Year: 2014
Automatic Detection of the Number of Raypaths in a Shallow-Water Waveguide
Publisher: IEEE
Year: 2014
[Title page]
Publisher: IEEE
Year: 2014
Development of a high density glass interposer based on wafer level packaging technologies
Publisher: IEEE
Year: 2014