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Low temperature wafer bonding for wafer-level 3D integration

Type: Conference Paper

Author : Dragoi, V. , Rebhan, B. , Burggraf, J. , Razek, N.

Publisher: IEEE

Year: 2014

Metabolic.Care: A hardware and software platform to monitor and assess diabetic foot condition

Type: Conference Paper

Author : Oliveira, Daniel; Sousa, Paula; Felizardo, Virginie; Garcia, Nuno C.; Alexandre, Celina; Garcia, Nuno M.

Publisher: IEEE

Year: 2014

Author

Alexandre, Celina (1)

Dragoi, V. , Rebhan, B. , Burggraf, J. , Razek, N. (1)

Felizardo, Virginie (1)

Garcia, Nuno C. (1)

Garcia, Nuno M. (1)

Oliveira, Daniel (1)

Sousa, Paula (1)

Publisher

IEEE (2)

Year

2014 (2)

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Bayes methods (2)

Aquarius/SAC-D observations (1)

Argentina (1)

artificial neural network (1)

Artificial neural networks (1)

atmospheric optics (1)

Bayesian algorithm (1)

brightness temperature (1)

H-pol single channel algorithm (1)

Measurement (1)

Type

Conference Paper (2)

Language (ISO)

English (2)

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Metadata Only (2)

Publication Title

-Health Networking, Applications and Services (Healthcom), 2014 IEEE 16th International Conference o (1)

ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on (1)

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