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High efficiency data center power supply using wide band gap power devices
Publisher: IEEE
Year: 2014
A method for UV-bonding in the fabrication of glass electrophoretic microchips
Year: 2001
Abstract:
This paper presents an approach for the development of methodologies amenable to
simple and inexpensive microchip fabrication, potentially applicable to dissimilar
materials bonding and chip integration. The ...
Artificial neural network based controller for active power line conditioner
Publisher: IEEE
Year: 2014
P+ multiple resonant control for output voltage regulation of microgrid with unbalanced and nonlinear loads
Publisher: IEEE
Year: 2014
Defining Value When Managing IT Investments
Publisher: IEEE
Year: 2014
Single-phase grid-tie photovoltaic inverter using maximum power point tracking with flyback converter
Publisher: IEEE
Year: 2014
Tri-axial all-metal inertial microswitch with compliant stationary electrodes to prolong contact time
Publisher: IET
Year: 2014
Microfabrication of a high-density, non-neutral antimatter trap
Publisher: IET
Year: 2014
An all-digital delay-locked loop for high-speed memory interface applications
Publisher: IEEE
Year: 2014
LTE Security potential vulnerability and algorithm enhancements
Publisher: IEEE
Year: 2014