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The selection of chemicals in CMP slurry via electrochemical screening
Publisher: IEEE
Year: 2014
Evolution of nature-inspired optimization for new generation antenna design
Publisher: IEEE
Year: 2014
Hybrid Au-Adhesive Bonding Using Planar Adhesive Structure for 3-D LSI
Publisher: IEEE
Year: 2014
Prediction of electric vehicle ownership based on Gompertz model
Publisher: IEEE
Year: 2014
Electrically independent subcircuits for a seven-junction spectrum splitting photovoltaic module
Publisher: IEEE
Year: 2014
Novel Electrical and Fluidic Microbumps for Silicon Interposer and 3-D ICs
Publisher: IEEE
Year: 2014
Application-Independent Testing of 3-D Field Programmable Gate Array Interconnect Faults
Publisher: IEEE
Year: 2014
Side trip multi-path routing protocol for spatial node failure tolerance in data-gathering WSNs
Publisher: IEEE
Year: 2014
Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICs
Publisher: IEEE
Year: 2014