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Guest Editorial<newline/>Special Section on the 2013 IEEE Custom Integrated Circuits Conference (CICC 2013)

Type: Journal Paper

Author : de la Rosa, Jos M.; Rogers, John W. M.; Chandra, Vishal

Publisher: IEEE

Year: 2014

Adjustable speed drives and motor protection

Type: Conference Paper

Author : Torres, Raymund; Hagphanah, Amir; Bower, Tryton; Delay, Robert; Paes, Richard

Publisher: IEEE

Year: 2014

Super-Resolving IC Images With an Edge-Preserving Bayesian Framework

Type: Journal Paper

Author : Zhengrong Wang; Hua Yang; Wenlong Li; Zhouping Yin

Publisher: IEEE

Year: 2014

CMP CONSUMABLES: Suppliers, applications, performance, and growth

Type: Conference Paper

Author : Roberts, B.

Publisher: IEEE

Year: 2014

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

Type: Journal Paper

Author : Bhattacharyya, Bidyut K.; Laskar, Nivedita; Debnath, Shoubhik; Baral, Debasis

Publisher: IEEE

Year: 2014

Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis

Type: Journal Paper

Author : Qiusheng Zhong; Zhong Chen; Xianmin Zhang; Guanghua Hu

Publisher: IEEE

Year: 2014

Inverse Source Solver for a High Resolution Near Field Scanner in Microelectronic Applications

Type: Journal Paper

Author : Zhiru Yu; Mei Chai; Mix, Jason /A/.; Slattery, Kevin P.; Qing Huo Liu

Publisher: IEEE

Year: 2014

Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

Type: Journal Paper

Author : Ash, W.M.; Meredith, W.F.; Banks, C.A.; Neskovski, N.N.; Wolff, B.; Monroe, K.; Casasnovas, A.

Publisher: IEEE

Year: 2014

Effects of Triboelectrostatic Charging Between Polymer Surfaces in Manufacturing and Test of Integrated Circuit Packages

Type: Journal Paper

Author : Panat, Rahul; Jinlin Wang; Parks, Edward

Publisher: IEEE

Year: 2014

Modeling the Flip-Chip Wetting Process

Type: Journal Paper

Author : Sylvestre, J.; Samson, M.; Langlois-Demers, D.; Duchesne, E.

Publisher: IEEE

Year: 2014

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Guest Editorial<newline/>Special Section on the 2013 IEEE Custom Integrated Circuits Conference (CICC 2013)

Adjustable speed drives and motor protection

Super-Resolving IC Images With an Edge-Preserving Bayesian Framework

CMP CONSUMABLES: Suppliers, applications, performance, and growth

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis

Inverse Source Solver for a High Resolution Near Field Scanner in Microelectronic Applications

Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

Effects of Triboelectrostatic Charging Between Polymer Surfaces in Manufacturing and Test of Integrated Circuit Packages

Modeling the Flip-Chip Wetting Process

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Guest Editorial<newline/>Special Section on the 2013 IEEE Custom Integrated Circuits Conference (CICC 2013)

Adjustable speed drives and motor protection

Super-Resolving IC Images With an Edge-Preserving Bayesian Framework

CMP CONSUMABLES: Suppliers, applications, performance, and growth

Innovative Scaling Method to Minimize Cost of Integrated Circuit Packages and Devices

Feature-Based Object Location of IC Pins by Using Fast Run Length Encoding BLOB Analysis

Inverse Source Solver for a High Resolution Near Field Scanner in Microelectronic Applications

Evaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing

Effects of Triboelectrostatic Charging Between Polymer Surfaces in Manufacturing and Test of Integrated Circuit Packages

Modeling the Flip-Chip Wetting Process