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The performance simulation of a novel SAW pressure sensor

Type: Conference Paper

Publisher: IEEE

Year: 2014

Development and characterization of new generation panel fan-out (P-FO) packaging technology

Type: Conference Paper

Publisher: IEEE

Year: 2014

Publisher

IEEE (2)

Year

2014 (2)

Keywords

CAD (2)

image classification (2)

image representation (2)

medical image processing (2)

Accuracy (1)

ANA IIF HEp-2 image classification problem (1)

ANA IIF HEp-2 image label (1)

antinuclear antibodies HEp-2 image classification (1)

antinuclear antibody test (1)

autoimmune diseases (1)

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Conference Paper (2)

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English (2)

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Metadata Only (2)

Publication Title

lectronic Components and Technology Conference (ECTC), 2014 IEEE 64th (1)

ontrol Conference (CCC), 2014 33rd Chinese (1)

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